International Business Machines Corporation

Teruhiro Nakasogi

Tetsuya Nogami

Kohji Murayama

Evan G Colgan

Chandrasekhar Narayan

James Marc Leas

Kei-Hsiung Yang

James Lawrence Sanford

Robert Lee Melcher

Howard L Kelly

Hans-George H Kolan

Yasunobu Hiromasu

To provide a liquid crystal device having a uniform vertical alignment, a method for fabricating it easily, and its fabricating apparatus in fabricating an ECB-type vertically aligned liquid crystal device, a liquid crystal device includes liquid crystal moleculeseach having a negative dielectric anisotropy and polyimide films for homogeneous alignment, wherein a method for fabricating a liquid crystal device including a process of vertically orienting liquid crystal molecules is constructed by exposing the liquid crystal molecules to light from either or both sides of substratesof the liquid crystal device whose liquid crystal molecules each having a negative dielectric anisotropy are homogeneously oriented using polyimide films for homogeneous alignment. In addition, an aligner used for exposure is equipped with a filer so as to cut light having wavelengths of 400 nm or less and 600 nm or more, so that light having a wavelength of 400 to 600 nm can be utilized. In this liquid crystal device, the response time becomes faster when a voltage is applied between electrodes

Liquid crystal device, fabricating method, and fabricating apparatus thereof

A TFT array substrate of the present invention includes an insulating substrate , thin-film transistors formed on the insulating substrate in a matrix, and wirings electrically connected to the thin-film-transistors. A gate-insulating film is formed on the wiring , a passivation film is formed on the gate-insulating film , and moreover an interlayer insulating film containing an organic polymer with an edge formed thereon is formed on the gate-insulating film . An etching stopper is formed on at least either of the gate-insulating film exposed from the edge of the interlayer insulating film or the passivation film

Thin-film-transistor-array substrate, thin-film-transistor-array fabrication method, and display device

An ECB-type vertically aligned liquid crystal device includes liquid crystal molecules each having a negative dielectric anisotropy and polyimide films for homogeneous alignment. In a process for manufacturing the liquid crystal device, the liquid crystal molecules are vertically oriented by exposing the liquid crystal molecules to light from either or both sides of substrates of the liquid crystal device. In addition, an aligner used for exposure is equipped with a filter so as to cut light having wavelengths of 400 nm or less and 600 nm or more, so that light having a wavelength of 400 to 600 nm can be utilized In this liquid crystal device, the response time becomes faster when a voltage is applied between electrodes.

FCB-type vertically aligned liquid crystal device

A spatial light modulator designed to use a minimum area on the surface of a silicon substrate. This invention comprises a silicon substrate on a back plate with a glass cover that is used to seal liquid crystal between the glass cover and the silicon substrate. Most importantly, the glue seal formed to contain the liquid crystal material is between the cover glass plate and the Si substrate on only one side and the back plate on the remaining three sides. This structure allows a smaller semiconductor substrate to be used.

Substrate structure and assembly method for reduced spatial light

An apparatus and method for spin coating a substrate with a liquid material which prevents the material from contacting the edge or backside of the substrate or forming an edge bead at the periphery of the substrate is disclosed. A spin chuck is equipped with a conformable elastomer which seals the edge of the substrate and forms a continuous surface with a planar surface of the substrate for the liquid material to flow off the substrate unimpeded during the spin coating process. As the elastomer is resilient, small variations in substrate size and shape are automatically compensated. None of the substrate area is lost to masking and/or removal processes as in the prior art, allowing the entire substrate area to be available for further processing.

Growing community of inventors

Shiga-ken, Japan

Teruhiro Nakasogi