Jsw Aktina System Co., Ltd.

Teruaki Shimoji

Daisuke Ito

Ryo Shimizu

Tatsuro Matsushima

A laser processing apparatus includes: a stagecapable of levitating and transporting a substrateby jetting gas from a front surface; a laser oscillator configured to irradiate a laser beamonto the substrate; and a gas jetting port arranged at a position overlapping a focus point position of the laser beamin plan view, and being configured to jet inert gas. The front surface of the stageis constituted by upper structuresand, and the upper structuresandare arranged so as to be spaced apart from each other and face each other. A gap between the upper structuresandoverlaps the focus point position of the laser beamin plan view. A filling memberis arranged between the upper structuresandso as to fill the gap between the upper structuresand

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Tokyo, Japan

Teruaki Shimoji