Tokyo Electron Limited

Teruaki Konishi

Koji Tanaka

Hideaki Sato

Osamu Kuroda

Hisashi Kawano

Takao Inada

Hiroshi Yoshida

Kotaro Tsurusaki

Kouzou Kanagawa

Toshiyuki Shiokawa

Hidemasa Aratake

Kouji Ogura

Keita Hirase

Jian Zhang

Seigo Fujitsu

Kazusige Sano

Koji Ogura

Takahiro Tetsuka

There is provided a substrate processing apparatus including: a processing part configured to process a substrate with a processing liquid; and a processing liquid generation part configured to generate the processing liquid supplied to the processing part. The processing liquid generation part includes: a reservoir configured to store the processing liquid; a circulation line through which the processing liquid stored in the reservoir is circulated; a heater configured to heat the processing liquid; and a nozzle provided at a downstream side of the circulation line and has at least one ejection port formed to eject the processing liquid heated by the heater from above a liquid level of the processing liquid stored in the reservoir.

Substrate processing apparatus and processing liquid concentration method

A substrate processing apparatus, a substrate processing method and a recording medium capable of shortening an etching processing time are provided. The substrate processing apparatus includes a substrate processing tub, a mixing unit and a supply line. The substrate processing tub is configured to perform an etching processing therein with an etching liquid. The mixing unit is configured to mix a new liquid with a silicon-containing compound or a liquid containing the silicon-containing compound. The supply line is configured to supply a mixed solution mixed by the mixing unit into the substrate processing tub.

Substrate processing apparatus, substrate processing method and recording medium

A processing liquid used in a substrate liquid processing apparatus can be supplied in a constant amount with high accuracy. A substrate liquid processing apparatus Aincludes a storage lineconfigured to store a processing liquid therein; an introduction lineconfigured to introduce the processing liquid into the storage line; a discharge lineconfigured to discharge the processing liquid from the storage line; and a gas supply unitconfigured to perform a strickling of the processing liquid by jetting a gas to a surface of the processing liquid stored in the storage line

Weighing apparatus, substrate liquid processing apparatus, weighing method, substrate liquid processing method and recording medium

Liquid processing unitseach for performing a liquid process on a substrate are arranged horizontally side by side, a gas exhaust pipefor exhausting an atmosphere within the liquid processing units is provided under the liquid processing unitsto be extended along an arrangement of the liquid processing units, and a flow control member groupis disposed under the gas exhaust pipe. Liquid supply main pipeand liquid drain main pipeare provided under the flow control member groupto be extended along the arrangement of the liquid processing units. Liquid supply branch pipes are branched from the liquid supply main pipeand connected with the liquid processing unitvia the flow control member group, and liquid drain branch pipes are branched from the liquid drain main pipeand connected with the liquid processing unit

Liquid processing apparatus

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Koshi, Japan

Teruaki Konishi