Matsushita Electric Industrial Co., Ltd.

Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Teruaki Kasai

Mitsuru Ozono

Kouji Oomori

Hiroshi Haji

Kazuo Arikado

Tadahiko Sakai

Takayuki Yoshida

Shinji Sasaguri

Masaru Nonomura

Naoto Ueda

Kazuhiro Noda

Takuma Motofuji

Norifumi Eguchi

Siniti Nakazato

Kouki Tsumura

Kenichi Takakura

A semiconductor laser device includes first heat radiator () having first flow path () and second flow path () inside to allow a flow of a refrigerant and second heat radiator () put in contact with an upper surface of the first heat radiator. The first flow path and the second flow path are independent of each other. The second heat radiator includes an insulating member that internally has third flow path () communicating with first flow path (). The semiconductor laser device further includes lower electrode block () disposed on a portion of an upper surface of the second heat radiator, submount () being made of a conductive material and being disposed on a remainder of the upper surface of second heat radiator (), semiconductor laser element () disposed on an upper surface of submount (), and upper electrode block () disposed such that submount () and semiconductor laser element () are clamped between the upper electrode block and second heat radiator (). Second flow path () is formed below a zone for the disposition of lower electrode block ().

Semiconductor laser device

Semiconductor laser device () includes lower electrode block () that has a first terminal hole and first and second connection holes, upper electrode block () that has third connection holes communicating with the respective first connection holes and a second terminal hole, heat sink () that has fourth connection holes communicating with the respective second connection holes, and optical component () attached to upper electrode block (). The first and the second connection holes are formed on both side of a recess that is formed to house a submount on which a semiconductor laser element is disposed. Lower electrode block () is disposed on heat sink (). Lower electrode block () and upper electrode block () are fastened together with first fasteners (), whereas lower electrode block () and heat sink () are fastened together with second fasteners ().

The semiconductor laser device of the present invention has a conductive first heatsink member, a conductive first adhesive, and a semiconductor laser element. The first adhesive is disposed on the first heatsink member, and the semiconductor laser element is disposed on the first adhesive. The first adhesive reaches an upper part of the side surface of the first heatsink member under the laser emission surface for laser emission of the semiconductor laser element. The structure further improves heat dissipation of the semiconductor laser element; at the same time, it is effective in obtaining laser light from the semiconductor laser element.

Semiconductor laser apparatus and method for manufacturing same

Provided is a component bonding method of bonding a semiconductor component having a thermosetting adhesive layer formed on a lower surface thereof to a circuit board having a resin layer formed on a surface thereof. In the method, wettability is improved by surface modification that performs a plasma treatment on a resin surface of the circuit board, the semiconductor component is held by a component holding nozzle having a heater, the adhesive layer is contacted to the surface-modified resin layer, and the adhesive layer is heated and thermally cured by the heater. Thereby, adhesion between the adhesive layer and the resin surface is improved, and thus the component holding nozzle can be separated from the semiconductor component without wait for completely hardening the adhesive layer. Accordingly, it is possible to improve productivity in the heat pressing process by reducing the time required for the component bonding.

Component bonding method, component laminating method and bonded component structure

In the pickup apparatus wherein a chip adhered on a sheet is sucked and held by a picking nozzle and then picked up by the nozzle, a sheet push-up member configured by forming flexible elastic material such as rubber in a spherical shape is attached on the abutment supporting surface of the upper surface of a tool, then the push-up surface of the sheet push-up member is followed in a flat surface state along the lower surface of the sheet and abutted thereto in the moving down state of the picking nozzle, and then the push-up surface pushes up the lower surface of the sheet while being deformed in a upwardly protruded curved surface shape in the moving up operation where the picking nozzle moves up together with the chip. Thus, the chip can be released from the sheet from the outer peripheral side of the chip.

Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method

In an adhesive sheet exfoliation process in a pick-up operation for a thin-type chipadhered to the adhesive sheeta suction exfoliation toolprovided at its adhesion surfacewith plural suction groovesis abutted against the lower surface of the adhesive sheet. Then, air within the suction groovesare vacuum-sucked to bend and deform the adhesive sheettogether with the chipthereby to exfoliate the adhesive sheetfrom the lower surface of the chipdue to such bending deformation. Thus, it is possible to realize the picking-up operation with high productivity without causing a problem such as breakage or crack.

Method and apparatus for picking up semiconductor chip and suction and exfoliation tool used therefor

A semiconductor chip pick-up apparatus includes: a pick-up head for picking up the chip on a sheet; a holding table for holding the sheet; a recognition means for recognizing the chip; a positioning means for positioning the chip relatively to the pick-up head on the basis of the recognition result by the recognition means; and a sheet separating mechanism for separating the sheet from the chip by sucking the sheet from a suction plane brought in contact with a lower surface of the sheet. The sheet separating mechanism includes: a plurality of sucking grooves formed in the suction plane; a plurality of boundary zones, each of which separates the sucking grooves adjacent to each other and supports the sheet in their contact with the lower surface of the sheet during sucking; suction members movably arranged in the sucking grooves, respectively so that when they are moved toward lower surface of the sheet, they are brought into contact with the lower surface of the sheet to suck the sheet; a moving means for moving the suction members; and a sucking means for sucking the sheet from said plurality of sucking grooves.

Apparatus and method for picking up semiconductor chip

A conductive ball transferring apparatus including: an arranging member having in its top face a plurality of recesses in a predetermined arrangement pattern each capable of receiving one conductive ball therein; a tilting mechanism for tilting the arranging member with respect to a horizontal plane; a speed controller for controlling the moving speeds of the conductive balls that move along the top face of the tilted arranging member in a direction the arranging member has been tilted; and a transferring head for picking up the conductive balls arranged by the arranging member and transferring them onto predetermined positions. With this structure, the moving speeds of the conductive balls are stabilized and the conductive balls are arranged into the recesses quickly without fail, and thereby the transferring head can pick up these conductive balls onto predetermined positions promptly.

Apparatus and method of transferring conductive balls and apparatus and method of supplying conductive balls

In a mounting apparatus for mounting conductive ball where a conductive ball,is picked up by vacuum to a suction hole,formed in the bottom of a suction head,for mounting on a workpiece, a reference wave form that represents the amount of light detected at a light detector,when a suction head,is sucking a conductive ball,rightly in the normal state is compared with a wave form detected at the light detector,when actually mounting the conductive ball; also a reference wave form detected at the light detector,when there is no conductive ball,at all on the suction head,is compared with a wave form detected at the light detector,after mounting of the conductive ball is finished. Through the above described processing, errors in the light interruption that stem from a tilted suction head,and machining errors during processing of suction holes,are eliminated, and the existence, or non-existence, of the conductive ball,is detected at a high accuracy level.

Method of mounting conductive ball

In a solder ball attaching apparatus, a pickup head is lowered and raised just above a solder ball feed section so as to pick up a large number of solder balls. The pickup head then moves to a position just above a flux feed section where the pickup head is lowered and raised so as to flux the solder balls. Further, the pickup head moves to a position just above a workpiece where the pickup head is lowered and raised so as to attach the solder balls onto electrodes of the workpiece. Alongside a transfer path of the pickup head are arranged first and second line light sources, a light-emitting element and a light-receiving element for monitoring presence or absence of a solder ball pickup error, dislodging of the solder ball and a solder ball attaching error.

Growing community of inventors

Osaka, Japan

Teruaki Kasai