Ebara Corporation

Hirata Corporation

Teruaki Hombo

Junji Kunisawa

Mitsuru Miyazaki

Fumitoshi Oikawa

Kenichi Kobayashi

Hiroyuki Shinozaki

Koji Maeda

Hideaki Tanaka

Tomoatsu Ishibashi

Toru Maruyama

Toshio Yokoyama

Fujihiko Toyomasu

Xinming Wang

Naoki Toyomura

Akira Imamura

Masayoshi Imai

Yohei Eto

Haruko Ono

Keiji Kanazawa

Boyu Dong

An object is to suppress dew condensation in a carrier device. There is provided a carrier device comprising a body; a rotational part provided to be rotatable relative to the body; an arm supported on the rotational part; an end effector provided in a leading end portion of the arm and configured to hold a work; a gas supply unit configured to supply a gas to an arm-side internal space provided in an arm-side base portion of the end effector and/or in the leading end portion of the arm; and an exhaust unit provided in a body-side internal space that communicates with the arm-side internal space and configured to discharge the gas in the arm-side internal space and/or in the body-side internal space.

Carrier device, work processing apparatus, control method of carrier device and storage medium storing program

A cleaning apparatus includes a plurality of processing units including a cleaning unit which cleans a processing object, a transport chamber provided between the plurality of processing units, a transport robot provided inside the transport chamber so as to be movable vertically, an exhaust port portion which discharges gas compressed, when the transport robot descends, from a lower portion of the transport chamber, and a liquid remaining unit which causes liquid transported to the compressed gas to remain in the lower portion of the transport chamber.

Cleaning apparatus and substrate processing apparatus

The present invention relates to a substrate processing apparatus for processing a substrate, such as a wafer, while supplying a cleaning liquid (e.g. pure water and a liquid chemical) to the substrate, and also relates to a pipe cleaning method for the substrate processing apparatus. The substrate processing apparatus includes: a first cleaning lane including first cleaning units (), () each for cleaning a substrate while supplying pure water to the substrate; a second cleaning lane including second cleaning units (), () each for cleaning a substrate while supplying pure water to the substrate; a first pure-water supply pipe () for supplying the pure water to the first cleaning lane; and a second pure-water supply pipe () for supplying the pure water to the second cleaning lane.

Substrate processing apparatus and pipe cleaning method for substrate processing apparatus

A substrate cleaning apparatusincludes a cleaning memberthat abuts on a substrate W to scrub and clean the substrate W, a holding memberthat holds the cleaning member, an air cylinderthat generates force to press the cleaning memberagainst the substrate W, a displacement sensorthat measures a position of the holding member, and a control devicethat determines the replacement time of the cleaning memberbased on the position of the holding member. The position of the holding memberincludes a cleaning position and a non-cleaning position. The control devicedetermines the replacement time of the cleaning memberfrom change in the cleaning position while a plurality of substrates W are continuously scrubbed and cleaned.

Substrate cleaning apparatus and method executed in the same

A substrate processing apparatus has a substrate rotating devicefor holding and rotating a substrate W, a cleaning deviceconfigured to clean a substrate W which is rotated by the substrate rotating deviceat predetermined rotating speed, a movement deviceconfigured to move the cleaning devicebetween a cleaning position Pand a separate position P, and a control unit. The control unitcontrols the movement deviceso that the cleaning devicelocated at the separate position Pstarts moving toward the cleaning position Pbefore a rotating speed of the substrate W held by the substrate rotating devicereaches the predetermined rotating speed and the cleaning devicereaches the cleaning position Pafter a rotating speed of the substrate W reaches the predetermined rotating speed. Therefore, it is possible to improve the throughput in the substrate cleaning step.

Substrate processing apparatus and processed substrate manufacturing method

A polishing apparatus is used for polishing a surface of a substrate such as a semiconductor wafer to planarize the surface of the substrate. The polishing apparatus includes a polishing table having a polishing surface, and a top ring configured to hold a substrate with an outer circumferential edge of the substrate surrounded by a retainer ring and to press the substrate against the polishing surface. The top ring is movable between a polishing position above the polishing table, a position laterally of the polishing table, and a cleaning position. The polishing apparatus includes a cleaning unit disposed in the cleaning position and configured to eject a cleaning liquid toward the lower surface of the top ring, which is being rotated, thereby cleaning the substrate held by the top ring together with the lower surface of the top ring.

Polishing apparatus and polishing method

A substrate is cleaned by performing a scrubbing process on a surface to be cleaned of the rotating substrate with a roll-shaped cleaning member while holding an outer circumferential surface of the roll-shaped cleaning member in contact with the surface to be cleaned of the substrate across a predetermined contact width. During at least a part of the scrubbing process, the roll-shaped cleaning member is placed at an offset cleaning position where the central axis of the roll-shaped cleaning member is spaced from the central axis of the substrate by a distance which is 0.14 to 0.5 times the contact width. The surface to be cleaned of the substrate is scrubbed with more uniform cleaning intensity while taking into account the cleaning intensity at each position (area) along the radial direction of the surface to be cleaned of the substrate.

Method and apparatus for cleaning substrate

Roller shaft for semiconductor cleaning

Growing community of inventors

Tokyo, Japan

Teruaki Hombo