Fujitsu Corporation

Teru Nakanishi

Kazunori Yamanaka

Akihiko Akasegawa

Nobuyuki Hayashi

Kazuaki Karasawa

Kazuaki Kurihara

Manabu Kai

Yasuhiro Yoneda

Toshiya Akamatsu

Masaru Morita

Masatoshi Ishii

Kozo Shimizu

John David Baniecki

Takahiro Kimura

Kaoru Hashimoto

Takeshi Shioga

Masataka Mizukoshi

Tsuyoshi Aoki

Hideo Kubo

Tsuyoshi So

Katsusada Motoyoshi

Yoshinori Uzuka

Masayuki Ochiai

Nobumitsu Aoki

Osamu Aizawa

Keisuke Sato

Toshihiro Sakamura

A cooling apparatus includes: an evaporator in which a coolant is housed and that evaporates the coolant; a condenser that condenses the coolant evaporated by the evaporator; a pathway section that includes a vapor path and a liquid path each placing the inside of the evaporator and the inside of the condenser in communication with each other, and that circulates the coolant between the evaporator and the condenser; a valve that is provided to at least one path out of the vapor path or the liquid path; and a pressure regulation section that increases an opening amount of the valve according to an increase in pressure inside the evaporator.

Cooling apparatus and electronic device

A cooling apparatus includes: a circulation path of coolant; a first pump provided in the circulation path, the first pump including a first inlet and a first outlet; a second pump connected to the first pump, the second pump including a second inlet and a second outlet; a first main pipe with one end connected to the first outlet; a second main pipe with one end connected to the second inlet; a connection portion connecting another ends of the first and second main pipe; a first bypass pipe connecting the first inlet and the connection portion; and a second bypass pipe connecting the second outlet and the connection portion, wherein the first main pipe and the second bypass pipe are connected in a same direction in the connection portion, and the second main pipe and the first bypass pipe are connected in the same direction.

A cooling device includes: a refrigerant circulation loop configured to depressurizing the inside thereof, the refrigerant circulation loop includes, an evaporator that vaporizes a part of refrigerant by heat generated by an electronic component, a condenser that cools the refrigerant, and a pump that circulates the refrigerant, wherein a filling ratio of liquid refrigerant to a volume of the refrigerant circulation loop is configured to maintain a refrigerant circulation capability of the pump.

Cooling device and electronic equipment

A cooling system, includes: an evaporator configured to take heat from a heat source by latent heat of evaporation of liquid; an aspirator configured to suck vapor generated in the evaporator and decompress an inside of the evaporator; a liquid supplying unit configured to supply liquid to the aspirator and the evaporator; and a gas mixing unit configured to mix gas into the liquid to be supplied from the liquid supplying unit to the evaporator.

Cooling device and electronic device system

A cooling system includes: an evaporator; a condenser; a feed pipe including a feed pipe body configured to couple an opening portion within the evaporator and the condenser, at least a portion of the feed pipe body in a longitudinal direction having an inner cross-sectional area smaller than an inner cross-sectional area of the opening portion; a return pipe configured to couple the condenser and the evaporator; and a bypass pipe configured to couple the evaporator and the feed pipe body.

Cooling system and electronic device

A semiconductor device includes: a wiring board including a first electrode pad on a surface thereof; a circuit board disposed to stand on the wiring board, and including an interconnection connected to the first electrode pad; and a semiconductor package disposed to face the wiring board with the circuit board interposed therebetween, and including a second electrode pad on a surface thereof, the second electrode pad being connected to the interconnection.

Electronic device

Electronic component

Semiconductor device

An electronic device includes a wiring board including a first electrode and a second electrode, a semiconductor device mounted on the wiring board and including a first terminal and a second terminal, an interposer provided between the wiring board and the semiconductor device, the interposer including a conductive pad and a sheet supporting the conductive pad, the conductive pad having a first surface on a side of the wiring board and a second surface on a side of the semiconductor device, a first solder connecting the first electrode positioned outside of an area in which the interposer is disposed with the first terminal positioned outside of the area, a second solder connecting the second electrode positioned inside of the area with the first surface of the conductive pad, and a third solder connecting the second terminal positioned inside of the area with the second surface of the conductive pad.

Electronic device, interposer and method of manufacturing electronic device

A superconductive filter includes a superconductive filter substrate having a dielectric substrate and a plurality of resonator patterns formed on a surface of the dielectric substrate, the plurality of resonator patterns including a superconductive material; a package accommodating the superconductive filter substrate; and an intermediate substrate disposed between an inner surface of the package and the superconductive filter substrate, and thermally coupling the package and the superconductive filter substrate wherein a difference between a degree of contraction of the intermediate substrate and the degree of contraction of the dielectric substrate is smaller than a difference between the degree of contraction of the dielectric substrate and the degree of contraction of the package, when the package, the intermediate substrate, and the dielectric substrate are cooled from room temperature to a critical temperature of the resonator patterns.

Superconductive filter with plurality of resonator patterns formed on surface of dielectric substrate

A filter includes a dielectric substrate; an electrode layer continuously formed covering a first side of the dielectric substrate; a disk-shaped electrode pattern provided on a second side of the dielectric substrate, the disk-shaped electrode pattern and the electrode layer holding the dielectric substrate therebetween; a ground slot having an opening that is formed asymmetrically with respect to the center of a circular area included in the electrode layer and exposes the dielectric substrate, the circular area and the disk-shaped electrode pattern holding the dielectric substrate therebetween.

Superconducting filter with disk-shaped electrode pattern

The coaxial connectorto be connected with a coaxial cable has a surface covering layerformed of a metal material which causes an eutectic reaction with In on the surface of a terminalwhich is a core conductor. Because of the surface covering layerof a metal material which causes the eutectic reaction with In formed on the surface of the terminal of the coaxial connector, the terminal of the coaxial connector and the electrode of a superconductor device can be jointed to each other by the solder layer of In-based solder at a relatively low temperature. Thus, the discharge of oxygen from the inside of the superconductor film of a superconductor filter can be suppressed, and the decrease of the critical temperature Tcan be suppressed.

Superconductor device

An electronic device includes a wiring board; a semiconductor device arranged at an upper side of the wiring board with an electrically conductive member being arranged therebetween; a covering member arranged at an upper side of the semiconductor device; and a supporting member arranged at a lower side of the wiring board, the supporting member having a convex portion facing the wiring board, the supporting member being connected to the covering member and supporting the wiring board at the convex portion.

Electronic device and method of producing the same

An electronic device includes an electronic component mounted on a substrate; a cooling system for cooling the electronic component; and a fastening structure for fastening the cooling system to the substrate. The fastening structure includes a first magnet provided to one of the substrate and the cooling system, a second magnetic material fixed to the other of the substrate and the cooling system and magnetically coupled with the first magnet, and a magnetic shield that covers a part or all of the first magnet except for a coupling face to be coupled with the second magnetic material.

In a wall of a package base made of aluminum or aluminum alloy, there is formed a through-hole, through which a semi-rigid coaxial cable passes. A central conductor of the semi-rigid coaxial cable is joined to an electrode with a solder material. The semi-rigid coaxial cable has an insulating material through which the central conductor passes and an outer conductor provided therearound. The central conductor and outer conductor are made of stainless steel, for example, and the insulating material is made of fluororesin, for example. Inside the through-hole, the wall of the package base and the outer conductor are electrically connected to each other via a stainless material within the hole formed in a cylindrical fluororesin material. The semi-rigid coaxial cable and the like are fixed to the wall with a conductive screw.

Growing community of inventors

Kawasaki, Japan

Teru Nakanishi