Mitsubishi Denki Kabushiki Kaisha

Teru Hirata

Yoshiharu Takahashi

Shigeo Onoda

Yasuhiro Murasawa

Tetsuro Washida

Jiro Oseto

A semiconductor device includes a semiconductor chip attached to a lead frame with recesses on the rear surface of the semiconductor chip opposite the lead frame. These recesses increase the heat radiation area of the semiconductor chip. In a method of producing a semiconductor device, the height of a cavity between upper and lower dies is smaller than the height of the semiconductor chip including bump electrodes. During a molding process, the bump electrodes contact the upper die or a dam surrounding the bump electrodes so that no thin burrs are produced on the surfaces of the bump electrodes in the molding process.

Method of making resin encapsulated semiconductor device with bump

An IC card includes a substrate having a metal fiber resin material layer made of a mixture of a resin and metal fibers and a conductive pattern. The conductive pattern and the metal fiber resin material layer are electrically insulated from each other by a resist film. Heat radiation and mechanical strength of the IC card are enhanced.

Growing community of inventors

Itami, Japan

Teru Hirata