Texas Instruments Corporation

Terry Wayne Noe

Rex Alan Naden

A magnetic bubble domain package which insures a coplanar relationship between the signal leads and the active surface of the magnetic bubble domain chip and also insures the precise location of the magnetic bubble domain chip within the most uniform part of the rotating magnetic field. The package utilizes a thin film of insulating material and chip means secured to the film to produce the coplanar relationship between the active surface of the chip and the signal leads. The package also includes a plastic coil carrier member which supports the inner drive coil and which may be prewound in a separate manufacturing operation. The coil carrier member is attached to the insulating material/chip means assembly in such a way as to locate the chip precisely in the center of the inner coil wound thereon. The bias field for the package is produced by two permanent magnets and two bias plates secured exterior to the drive coils, and is adjustable by means of a screw of high-permeability material located within the package.

Magnetic bubble memory package

A packaging assembly for magnetic bubble chips comprising at least one module assembly board having a surface to which is secured in a substantially planar array a plurality of magnetic bubble chips for the storing and processing of information. First and second sets of terminals are located on opposed lateral edges of the module assembly board for the routing therethrough of information to and from the chips. First and second mounting boards are provided, each board having a set of receptacles for the soldering thereto of a corresponding set of the terminals. A first coil surrounds the module assembly board and is wound about an axis parallel to that of the plane of the chips for producing a magnetic field parallel thereto. A second coil surrounds the first coil and is wound about an axis perpendicular to that of the first coil and parallel to that of the plane of the chips for producing a magnetic field parallel thereto. A bias field source is positioned exterior to the second coil to produce a substantially constant magnetic field perpendicular to the plane of the chips. The first and second coils are excited to produce a rotating magnetic field parallel to the plane of the chips to control the movement of magnetic bubbles therein. Control components for the storage and processing of information in the chips are also provided. Convenient access to the chips may be gained by the sequential disassembly of the bias field source, the second coil, reheating the solder connection between the terminals and receptacles, and the first coil.

Magnetic bubble chip packaging assembly

A dual-in-line plastic package for an integrated circuit is assembled with the use of a thermal stress-resistant thin-film interconnect pattern on a flexible insulator film. All electrical connections to the semiconductor chip are made simultaneously by bonding directly to the thin-film interconnect pattern. Each segment of the interconnect pattern is then connected simultaneously to a simplified external lead frame, by means of a novel soldering technique. The assembly is then ready for plastic encapsulation and final trimming. By supplying both the flexible interconnect pattern and the external lead frame in continuous coils or reels, a high degree of handling simplicity, speed and accuracy is achieved with a maximum opportunity for automation, to produce a low work content product.

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Richardson, TX, United States of America

Terry Wayne Noe