Amkor Technology, Inc.

Other

Terry W Davis

Jae Jin Lee

Jae Hak Yee

Jae Hun Ku

Ludovico Estrada Bancod

Young Suk Chung

Sang Hyun Ryu

Jae Sung Kwak

Chung Suk Han

Ahmer Raza Syed

William M Anderson

Sun Jin Son

Primitivo A Palasi

Harry J Fogelson

Tom Hu

Leocadio M Alabin

Won Dai Shin

Ludcvico Estrada Bancod

Ian Kent

A guitar picking device includes a first securement body, having a first lip to secure around a first finger; a second securement body, having a second lip to secure around a second finger; and a guitar pick secured between the first securement body and the second securement body; the guitar pick faces away from a user's knuckles when the first securement body and the second securement body are secured around the first and second finger.

String instrument picking system

In accordance with the present invention, there is provided a punch quad flat no leads (QFN) semiconductor package including a leadframe wherein the leads of the leadframe are selectively half-etched so that only one or more prescribed leads may be electrically connected to a conformal shield applied to the package body of the semiconductor package. The conformal shield may be electrically connected to the exposed lead(s) alone, or in combination with one or more tie bars of the leadframe. In one embodiment, outer end portions of the top surfaces of the leads of the semiconductor package are alternately exposed and non-exposed, with the non-exposed leads including a top side half-etch which causes the same to be effectively covered by the package body of the semiconductor package.

Conformal shield on punch QFN semiconductor package

A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the corners of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant

A semiconductor package comprising a plurality of elongate leads which each have opposed inner and outer ends, opposed first and second surfaces, and a third surface which is disposed in opposed relation to the first surface and recessed relative to the second surface. The second surface of each lead is positioned in close proximity to the inner end thereof. The third surface of each lead extends to the outer end thereof. A semiconductor die is attached to portions of the first surfaces of at least some of the leads. The semiconductor die is itself electrically connected to at least some of the leads. A package body covers the semiconductor die and the leads such that the second surfaces of the leads are exposed in a bottom surface of the package body and the outer ends of the leads are exposed in respective side surfaces of the package body.

Method for fabricating a fan-in leadframe semiconductor package

Fan-in leadframe semiconductor package

A lead frame comprising a frame which defines a central opening. Disposed within the central opening is a die pad which is connected to the frame. Also connected to the frame are a plurality of leads which extend within the opening toward the die pad. Each of the leads defines opposed top and bottom surfaces, an inner end, an outer end, and an opposed pair of side surfaces. The bottom surface and the outer end collectively define a corner region of the lead. Formed within the corner region is a recess which is sized and configured to accommodate the flow of reflow solder thereinto.

Lead frame with plated end leads

Leadframe having lead locks to secure leads to encapsulant

A method of fabricating a semiconductor package comprising the step of providing a leadframe strip which defines a strip plane and a multiplicity of leadframes. Each of the leadframes includes an outer frame defining a central opening and a die pad disposed within the central opening. Each leadframe further includes a plurality of leads which are attached to the outer frame and extend toward the die pad in spaced relation to each other. The outer frames are integrally connected to each other and collectively define connecting bars which extend in multiple rows and columns and define saw streets. Semiconductor dies are attached to respective ones of the die pads, with the semiconductor dies being mechanically and electrically connected to the leads of respective ones of the leadframes. Thereafter, an encapsulant material is applied to the leadframe strip to form at least one mold cap which at least partially encapsulates the leadframes, the semiconductor dies, and the conductive wires. The leadframe strip and the mold cap collectively define a package strip. Isolation cuts are formed through the package strip along at least some of the saw streets to effectively electrically isolate the leadframes from each other.

Leadframe strip having enhanced testability

A method of fabricating semiconductor packages from a lead frame strip which includes a mold cap applied to one side thereof, and defines a multiplicity of lead frames integrally connected to each other by connecting bars which extend in multiple rows and columns and define saw streets. In the singulation method of the present invention, the mold cap is sawed along the saw streets to expose the connecting bars. Thereafter, the connecting bars are chemically etched to separate the lead frames from each other.

Saw and etch singulation method for a chip package

An integrated circuit chip package comprising a lead frame having an integrated circuit die electrically connected thereto. Partially encapsulating the lead frame and the integrated circuit die is a package body. The package body includes the central portion which is circumvented by a peripheral portion defining opposed top and bottom surfaces. Disposed in at least one of the top and bottom surfaces of the peripheral portion of the package body is a singulation crease. The singulation crease, which is formed in the package body during its molding process, is used to provide a stress concentration line which reduces stress along the edge of the chip package and avoids chipping and cracking problems during the punch singulation process used to complete the manufacture of the same.

Semiconductor package with singulation crease

A lead frame for making a semiconductor package is disclosed. The leadframe's leads include a lead lock provided at a free end of each inner lead that is adapted to increase a bonding force of the inner lead to a resin encapsulate, thereby effectively preventing a separation of the inner lead from occurring in a singulation process involved in the fabrication of the semiconductor package. A semiconductor package fabricated using the lead frame and a fabrication method for the semiconductor package are also disclosed. The lead frame includes a paddle, a plurality of tie bars for supporting the comers of the paddle, a plurality of leads arranged at each of four sides or two facing sides of the paddle in such a fashion that they are spaced apart from an adjacent side of the paddle while extending perpendicularly to the associated side of the paddle, each of the leads having lead separation preventing means adapted to increase a bonding force of the lead to a resin encapsulate subsequently molded to encapsulate the lead frame for fabrication of the semiconductor package, and dam bars for supporting the leads and the tie bars. Additional package embodiments include exposed protrusions extending downward from the leads. The exposed protrusions are irradiated with a laser to remove set resin prior to a solder ball attachment step.

Growing community of inventors

Gilbert, AZ, United States of America

Terry W Davis