Eastman-kodak Company

Terry Tarn

Edward J Ozimek

David N Bull

Edward Carnall, Jr

William F DesJardin

Luis A Rivera

Thomas G Bailey

A method of packaging image sensors using an optical grade adhesive and cover plate over the image sensor.

Method of packaging image sensors

A package design and a method of assembling an array of CCD image devices on a substrate to provide an assembly with an optically flat surface. A tolerance of approximately between 2 and 3 microns is achieved by a process requiring less finishing of the substrates used by conventional processes. The assembly package can be used to bond an array of image sensors on a substrate having less than optimum flatness while still maintaining the optical surfaces of the image sensors within a single focal plane.

Assembly technique for an image sensor array

A method of producing a package for an image sensor using several applications of adhesive and a glass cover plate is set forth.

Packaging medical image sensors

Apparatus and a method for the packaging of semiconductor chips to simplify assembly while improving thermal dissipation from the chip and reducing stress in the chip due to differential thermal expansion between the chip and its package as they are cycled over a temperature range are disclosed. An adhesive tape covers an active area of the chip and leaving bonding pads on the chip exposed through a recess in the adhesive tape. A body with a similar recess supports the other side of the tape. Wire bonds are made in the recess to connect bonding pads on the body to the chip. A lid covers the recess to protect the wire bonds.

Package and method for assembly of infra-red imaging devices

A method for bonding a color separation filter to an image sensor. The method comprises the steps of dispensing an optical coupling composition on a preselected surface of at least one of the filter and sensor; bonding the filter to the sensor for creating a filter-sensor assembly, by using a predetermined amount of UV curable adhesive at an interface of the filter-sensor assembly; and, dispensing an epoxy along a periphery of the filter-sensor assembly, thereby encapsulating the optical coupling composition at the interface of the filter-sensor assembly.

Method for bonding a color separation filter to an image sensor

An integrated circuit package for a charge-coupled image sensor. The package comprises first and second ceramic bodies being fused together to form a unitary structure; a CCD image sensor mounted on the first ceramic body; and, electrical circuitry mounted on the second ceramic body.

Integrated circuit package for an image sensor

An optical sensor uses a transparent molded polycarbonate cover to achieve improved quality and reduced cost. The optical sensor includes a CCD supported on a ceramic support plate with leads attached to the support plate and with the polycarbonate cover over the CCD. The cover is shaped like an inverted cup. The base of the cup forms a flat light-transmitting surface and the walls of the cup form a spacer that assures that the light-transmitting surface is held a substantial distance away from the CCD. Any shadows of anomalies on the light-transmitting surface are diffused by the substantial space. The optical sensor is thus made highly resistant to producing false signals. The optical sensors are assembled in a series of operations through which they are passed while interconnected with handling members attached to their respective leads. The handling members are positioned and attached to leave a space directly under the ceramic support plate. This facilitates ease and efficiency of manufacturing and keeps cost down.

Optical sensor and method of production

The present invention relates to a solid state assembly having a solid state device bonded to a terminal board of an insulating material having a plurality of metal terminal pads thereon and arranged in a pattern. A metal bump is on each of the terminal pads of the terminal plate with an amalgam layer covering at least a top of each bump. The solid state device has a plurality of metal terminal pads thereon. The solid state device is mounted on the terminal board with each of its terminal pads being seated on the amalgam of each bump on the terminal board. The assembly is formed by placing some amalgam on each of the bumps on the terminal plate. The solid state device is then mounted on the terminal plate and the amalgam is hardened, such as by heating at a low temperature, to bond the amalgam to the bumps and the solid state device terminal plates. Once the device is bonded to the terminal board, the temperature the assembly is subject to can be higher than the temperature used for the bonding operation without causing any harm to the bond.

Bonding of solid state device to terminal board

Method and apparatus are disclosed for mounting a second optical component on a first optical component using a spacer layer for forming a controlled gap between the two components. In a preferred embodiment, a CCD sensor is formed having a non-active area and an active area for detecting lightwaves. A spacer layer of an epoxy or similar material is formed on at least a portion of the non-active area of the sensor. A fiber optic faceplate is mounted on the spacer layer to form the controlled gap between the active area of the CCD sensor and the faceplate. The fiber optic faceplate has a predetermined index of refraction for passing lightwaves towards the active area of the sensor. A coupling compound, having an index of refraction which substantially matches that of the faceplate, is used to fill the controlled gap between the faceplate and the active area of the sensor.

Growing community of inventors

Pittsford, NY, United States of America

Terry Tarn