Cts Corporation

Terry R Bloom

Richard O Cooper

John Zdanys

David Larry Poole

Robert L Reinhard

Marion E Ellis

Craig N Ernsberger

Charles C Kuo

Lewis L Seffernick

Robert M Vandenboom

Stephen W Burry

Jeffrey R Jacquin

Kim D Cook

Mark D Erickson

Raymond G Blair

Curtis L Holmes

John F Nespor

Shouliang Lai

Ronald D Guyer

A sensor is disclosed for sensing an applied load. The sensor includes a rigid substrate. A strain sensitive resistor is mounted to the substrate. The resistor has a pair of ends. The resistor has a length and a width that defines an area. A pair of conductors are connected to the end of the resistor. A dielectric layer is mounted over the resistor. A load transfer device is mounted to the dielectric layer. The load transfer device transfers the applied load directly to the strain sensitive resistor such that the resistor is compressed. The resistor changes resistance in response to the applied load.

Compression strain sensor

A ball grid array package includes a substrate with a top and bottom surface. A circuit component is located on the bottom surface. The circuit component has a pair of ends. A pair of conductors are located on the bottom surface. The conductors are connected to the ends of the circuit component. A conductive epoxy covers a portion of the conductors and a portion of the bottom surface. The conductive epoxy is in electrical contact with the conductors. A ball is connected to the conductive epoxy. The conductive epoxy provides an electrical connection between the conductor and the ball. The ball is preferably copper and is subsequently coated to prevent corrosion. Other embodiments of the invention are shown in which the balls are omitted and in which the conductive epoxy is used to fill vias in a substrate.

Ball grid array package

A strain sensor that is suited for use as an occupant weight sensor in a vehicle seat is disclosed. The strain sensor includes a substrate having a top surface and a bottom surface. Several bumps are located on the top surface. The bumps extend above the top surface. The bumps are arranged in a pattern. A dielectric material is located on the top surface. At least one strain sensitive resistor is located on the dielectric material. Several conductive traces are formed on the dielectric material and are electrically connected with the strain sensitive resistor.

Strain sensor having improved accuracy

A ball grid array package that can be readily tested before or after mounting to a printed circuit board. The ball grid array includes a substrate having a top surface and a bottom surface. Several conductive pads are located on the top surface. Several passive circuit elements are located on the top surface between the conductive pads. An insulative coating is placed on top of the passive circuit elements and the substrate. The insulative coating has openings over the conductive pads. The openings are adapted to be accessible by an electrical probe. Conductive vias extend through the substrate between the top and bottom surfaces. The vias electrically connect with the conductive pad on the top surface. Several conductive balls are located on the bottom surface. Each conductive ball is electrically connected to one of the vias.

Ball grid array package having testing capability after mounting

A cost-effective communication filter is prepared by etching the surfaces of a shaped and fired ceramic core, applying an electroless nickel solution to create a nickel layer of limited thickness, electroplating the nickel plated core with a silver layer, patterning the nickel and silver plated core by removing metallization from selected surface areas and then heating the patterned filter block to bond the metal layers. The resulting filters comprise a rigid dielectric core defining a plurality of through-hole passages extending between opposing sides of the core. Present on the core is a pattern of metallized and unmetallized regions wherein the metallized regions of the pattern include an inner layer of nickel and an outer silver-containing layer.

Dielectric block signal filters with cost-effective conductive coatings

A conductive composition for filling a via. The composition is based on total composition and has 4.0-12.0 wt. % organic vehicle and 88.0-96.0 wt. % electrically conductive particles selected from the group consisting of silver and nickel and mixtures thereof.

Conductive via composition

A ball grid array resistor network has a substrate that has top and bottom surfaces. Resistors are disposed on the top surface. Conductors are disposed on the top surface, and each conductor is electrically connected to an end of each resistor. Vias extend through the substrate and are electrically connected to the conductors. Solder spheres are disposed on the bottom surface, and are electrically connected to the vias. A cover coat is disposed over the conductors and resistors. In an alternative embodiment, the vias are eliminated and the resistor network is formed on the bottom surface of the substrate. The resistor network provides a high density of resistors per unit area.

Ball grid array resistor network

A copper conductor formulation which exhibits outstanding properties when fired upon an aluminum nitride substrate is disclosed. The conductor formulation primarily includes copper and further includes oxygen-bearing copper, lead monoxide containing glass and a screening agent. A conductor formed in accord with the invention exhibits outstanding properties including initial and aged adhesion, conductivity and solderability.

Copper ink for aluminum nitride

A wave transmission line terminator having application in computer data buss termination, single and multiple channel analog transmission line termination and other similar terminations uses thick film components including resistors and capacitors in combination with a ball grid array termination. The thick film resistors are placed on a first side of a substrate opposite the capacitors and ball grid array, and are electrically connected thereto by electrically conductive vias in the substrate. Several different configurations are disclosed which make the terminator more suitable for specific application.

Ball grid array R-C network with high density

A fuel level indicator system that utilizes a resistor card having an arc-shaped resistive path with a first set of spaced apart conductor lines and an arc-shaped resistive ink material overlying the first set of conductor lines. The first conductor lines are formed at an angle with respect to a radial line drawn from the center of the resistive path arc. The resistor card also has an arc-shaped continuously solid conductor base and a second set of spaced apart conductor lines extending from the base at an angle with respect to a radial line drawn from the center of the arc-shaped conductor base. The system includes a wiper assembly having a pair of spaced apart arms. Each arm has a plurality of parallel fingers extending from one end. One of the fingers on a first arm engages a conductor line on the resistive path and a second finger on the first arm engages an adjacent conductor line along the resistive path. A first finger on the second arm engages a conductive line on the conductive path; and a second finger engages an adjacent conductor line on the conductive path. The wiper assembly is constructed and arranged to provide rotational movement along the arc-shaped conductive path and arc-shaped resistive path. The system also has a float with an extending lever that is connected to the wiper assembly to produce rotational movement of the wiper assembly as the float moves.

Fuel system low current rheostat

A ball grid array capacitor has a substrate with a top and bottom surface and a via extending through the substrate. Several capacitors are located on the bottom surface. The capacitors include a top electrode connected to the via, a dielectric layer connected to the top electrode, and a bottom electrode that is connected to the dielectric layer and a ball pad over the bottom electrode. A passivation layer is located between the capacitors. Several solder spheres are electrically and mechanically connected to the bottom electrode. A resistor can be mounted on the top surface and connected to the via to form a filter.

Ball grid array capacitor

A resistor network for terminating active electronic devices has low cross talk noise between the adjoining resistors and the conductors that connect the resistors to other electronic packages. A substrate has a top and a bottom surface. Resistors are located on the top surface. Conductors are also located on the top surface and are electrically connected to each end of the resistors. Vias extend through the substrate and electrically connect to the conductors. Solder spheres are positioned on the bottom surface and are electrically connected to the vias. An end of each of the resistors is electrically connected in common through a common conductor. The commoned resistors are electrically connected to a common via through the common conductor. The resistor network minimizes cross talk noise between the resistors and provides a high density interconnection.

Low cross talk ball grid array resistor network

An aluminum nitride housing is molded which includes open holes that pass through the walls. A lead frame is formed by machining or chemically milling individual leads and details therein to form desired circuitry patterns. The lead frame is inserted through the open holes in the aluminum nitride housing and chemically and mechanically bonded thereto using active braze The active braze attaches the lead frame not only to the open holes in the package, but also to the wall of the housing over a larger area. Active braze forms a strong bond between the aluminum nitride and the lead frame, and also forms an excellent and highly reliable thermal junction therebetween. Several different package constructions are illustrated. In one design the aluminum nitride takes on a bathtub configuration onto which a flat cover may be attached. In an alternative embodiment, a metal seal ring is brazed to a relatively flat aluminum nitride base, which allows prior art roller welding, soldering or brazing of a lid to the seal ring after all devices are installed into the aluminum nitride package. The resultant packages are hermetic, reliable, corrosion resistant, and capable of withstanding extremely high temperatures with no loss of hermeticity.

Molded aluminum nitride packages

Solder active braze compositions are disclosed which enable the formation of circuit traces having improved leach resistance during soldering operations so that it is not necessary to apply protective coatings onto the circuit traces. Additionally, the solder active braze compositions disclosed herein can be readily soldered to so that it is not necessary to separately apply a coating onto the circuit trace so that electrical connections can be made to the traces by soldering. Also disclosed are electronic assemblies comprising circuit traces formed from the particular solder active braze compositions, and methods of forming such electronic assemblies.

Solder active braze

Hermetically sealed chip packages are described which are capable of withstanding elevated temperatures and accompanying temperature fluctuations. The chip packages feature electrically conductive, hermetic vias which provide electrical pathways through generally dielectric ceramic substrates employed in the chip package. Methods of forming such hermetic vias are also disclosed.

Growing community of inventors

Middlebury, IN, United States of America

Terry R Bloom