International Business Machines Corporation

Terry Leo Sobotta

Arvind Kumar Sinha

Eric Alan Eckberg

John Saunders Corbin, Jr

John Lee Colbert

Roger Duane Hamilton

Jason R Eagle

Michael Scott Good

David George Lund

Robert Francis Lusch

Amanda Elisa Mikhail

Kevin R Qualters

William Fred Otto

Roger F Dimmick

Jerry Richard Rasmussen

William S Ebert

James A Melville

John E Swenson

Jeff A Jajowka

Gary A Fitterer

Jason Rodney Eagle

John Saunders Corbin Jr

An apparatus is provided having an integrated circuit device disposed on a printed circuit board and a heat dissipation device on the integrated circuit device. An actuation screw in a spring plate is urged against a portion of the heat dissipation device by tightening the actuation screw. The actuation screw may be prevented from being tightened beyond a mechanical constraint corresponding to a pre-set calibration for the specific compressive force, which may be greater than or equal to a minimum compressive force corresponding to the greater of a minimum thermal interface pressure and a minimum contact interface pressure. Additionally, a method is provided in which the actuation screw is tightened, but prevented from being tightened beyond the mechanical constraint.

Heatsink apparatus for applying a specified compressive force to an integrated circuit device

An assembly for use in providing EMI shielding for a circuit card. The assembly comprises a circuit card; a fastener; and, a shielding apparatus. The shielding apparatus comprises: a body providing EMI shielding and includes an attaching portion extending therefrom, wherein the attaching portion has a segment at a proximal end portion thereof which blocks an opening in the body for controlling EMI leakage and positions the attaching portion so that a fastener can fasten the attaching portion to a circuit card such that a first fastener end portion is engageable in juxtaposed relationship with a first card surface and a second fastener end portion terminates so as not to extend generally beyond a predetermined distance from a second card surface of the card.

Apparatus, assembly and system for enhancing EMI shielding

An interface includes an enclosure having a plurality of walls interconnected to form a parallelepiped having a space therein. The enclosure is positionable to occupy a plurality of slots located in a computer housing of a first type computer. The enclosure has a width corresponding essentially to a total width of the plurality of slots. The interface further includes a computer subsystem of a second type computer disposed within the space of the enclosure. The computer subsystem includes a circuit card, and a distribution card attached to, and electrically coupled with, the circuit card. The distribution card is connectable to a backplane of the first type computer located external to the enclosure and within the computer housing.

Computer interface for integrating a first computer into a second computer

An interconnected book-package system permitting the circuit boards within book packages to communicate exclusively of the backplane (e.g., 300). This permits a circuit board that would otherwise have to be constructed from a larger than standard size circuit board and housed within a larger than standard size book package to be formed out of two standard size or smaller circuit boards housed within standard size book package assemblies. This is especially useful to customers seeking upgrade flexibility. The book packages of the interconnected system are connected mechanically and electrically exclusively of the backplane by a connection assembly (e.g., 502, 414, 504, 416) that makes it possible to blindly plug the book packages together. Multi-book latch assemblies include a clip (e.g., 702 and/or 704) used to interconnect the latches on a pair of book packages so that the connected books can be plugged into the backplane as a unit. An electrically conducted gasket is positioned between two connected book packages and around the connection assembly to provide ESD and EMI protection for the interconnected circuit boards. A floating backplane connector relieves the build up of tolerance between book packages of the same pitch and permits such book packages that have been connected together to be connected to a backplane having a difference pitch. Resilient clips (e.g., 500) are also used to join adjacent book packages.

Inter-book-package mechanical and electrical connection system

An expansion module for use in a computer system is disclosed. The expansion module holds a first card, which has a data processing unit and associated memory coupled together via a high speed internal local bus and an external coupler for an external peripheral device. An expansion coupler is also provided for coupling a second expansion card to the first card. The expansion module has a system connector for connecting the expansion module to a lower speed input-output bus of a computer system. The module can also accommodate additional SIMM modules as its associated memory. The module uses sidewalls or book covers made of a shielding material to provide electrical shielding and protection from external conditions. The expansion module improves the upgradeability and expandability of a data processing system.

Computer expansion module apparatus

Growing community of inventors

Byron, MN, United States of America

Terry Leo Sobotta