The Budd Company

Fitzpatrick Technologies

Terry L Ingham

Richard B Freeman

Jack J Ritchie

Joseph A Bodary

John J Morse

Robert C Yen

James A Bono

A pallet having an upper deck and a lower deck secured by supporting block members. The upper deck may include a plurality of board members and may be provided with at least one lead board operable to serve as an energy attenuator. The lead board may comprise a composite material and may be formed using pultrusion techniques. The lead board may be separated or spaced from an adjacent board member by a gap or scallop type area and may be operable to flex inwardly or otherwise upon impact to absorb energy. The gap or scallop type area may be suitable to operate in combination with the lead board as a handle mechanism for grabbing or lifting the pallet. The lead board may also be used to attach shipping straps.

Pallet with lead board

A pallet made of sheet molding compound (SMC) preferably includes a lower deck having unidirectional fibers therein and an upper deck having randomly oriented fibers therein. The upper and lower decks are assembled by heat staking the decks together with thermoplastic blocks.

SMC pallet

A transfer/injection molding apparatus is defined that includes a charge forming unit, a molding unit and a charge overflow unit. The charge is formed so that the fibers therein are randomly oriented in substantially parallel horizontal planes such that they are always substantially parallel to the direction of initial flow into the cavity of the molding unit. Excess charge from the cavity is forced into the charge overflow unit, which is selectively located in an area where surface finish is less critical. The excess charge displaces an overflow pin, which is kept upwardly biased, under molding pressure, to be flush with the lower inside wall of the molding unit cavity.

Molding apparatus with charge overflow

The present invention provides an electrically conductive sheet molding compound composition adapted for electrostatic painting comprising a resin mixture including about 20 to about 60% by weight of thermoplastic resin based on the total weight of said resin mixture, the thermoplastic resin being selected from the group consisting of styrene-butadiene rubber, polystyrene, saturated polyester resin, and mixtures thereof; fibrous reinforcing material; and conductive material. The conductive material is added to the sheet molding compound composition in a sufficient quantity to render an article molded with said composition with structural integrity and electrically conductive enough to be electrostatically painted.

Conductive sheet molding compound

An automated transfer/injection molding apparatus and process is defined that includes a charge forming unit, a shuttle unit, and a molding unit. The charge is formed from one or more slabs of reinforcing fibers and a resinous material. Once formed, the charge is preheated in the charge shuttle unit and is delivered to the molding unit, whereupon the preheated charges are forced by the pressure of a movable platform under vacuum into a mold cavity for polymerization. The fibers within the slabs are randomly oriented in parallel horizontal planes such that they are always parallel to the direction of initial flow into the cavity.

Automated thermoset molding apparatus

An automated transfer/injection process is defined that includes a charge forming unit, a shuttle unit, and a molding unit. The charge is formed from one or more slabs of reinforcing fibers and a resinous material. Once formed, the charge is preheated in the charge shuttle unit and is delivered to the molding unit, whereupon the preheated charges are forced by the pressure of a movable platform under vacuum into a mold cavity for polymerization. The fibers within the slabs are randomly oriented in parallel horizontal planes such that they are always parallel to the direction of initial flow into the cavity.

Growing community of inventors

Oxford, MI, United States of America

Terry L Ingham