Hewlett-packard Development Company, L.p.

Other

Hewlett-packard Company

Terry E McMahon

Donald W Schulte

Stan E Leigh

Charles Craig Haluzak

Simon Dodd

Chien-Hua Chen

Kenneth E Trueba

Lawrence H White

David Douglas Hall

Tom P Abadilla

Eric T Martin

Frank R Bryant

Adam L Ghozeil

Rio Rivas

Zhizhang Chen

James A Feinn

Anthony M Fuller

Mohammed Saad Shaarawi

Keith E Moore

Sriram Ramamoorthi

Ed Friesen

Antonio Cruz-Uribe

Satya Prakash

Sean P McClelland

Timothy F Myers

Dennis W Tom

Richard Todd Miller

Colby Van Vooren

S Jonathan Wang

Gregory T Hindman

Stanley J Wang

William B Connors

Andrew L Van Brocklin

Alexander N Govyadinov

James W Ring

James Richard Przybyla

Sterling Chaffins

Kevin P Dekam

Brett E Dahlgren

Donald J Milligan

Robert W Shreeve

Thomas A Saksa

Paul F Reboa

Douglas Pederson

Reynaldo V Villavelez

Kellie Susanne Jensen

Amy Gault

Jami Ryan Barone

Thomas P Abadilla

Tony Fuller

Robert Vina

In an example, an apparatus includes processing circuitry comprising a model assessment module to identify an indication of a conductive element within object model data representing an object to be printed and a print instruction module to generate print instructions to generate the object. The print instructions may include an instruction to print conductive agent to form the conductive element and an instruction to print a fusing agent comprising an instruction to reduce an amount of fusing agent to be printed in a region of the conductive element compared to at least one other region of the object.

Printing conductive elements

A fluidic die includes fluid chambers, each including an electrode exposed to an interior of the fluid chamber and each having a corresponding fluid actuator operating at a high voltage. The fluidic die further includes monitoring circuitry, operating at a low voltage relative to the fluid actuator, to monitor a condition of each fluid chamber, for each chamber the monitoring circuitry including a connection structure and a select transistor and a pulldown transistor connected to the electrode via the connection structure. The connection structure and select and pulldown transistors together structured to form electrically conductive paths with electrical resistances to protect at least the select transistor from fault damage if the high voltage fluid actuator short-circuits to the electrode.

Fluidic die with monitoring circuit fault protection structure

In one example in accordance with the present disclosure, a fluidic die is described. The fluidic die includes a surface on which a number of nozzles are formed. An electrical interface on the fluidic die establishes an electrical connection between the fluidic die and a fluidic die controller. The electrical interface includes 1) a bond pad disposed within a bond pad region of the surface and 2) an electrical lead coupled to the bend pad to establish an electrical connection between the fluidic die and the fluidic die controller. The fluidic die also includes a beveled edge along an edge of the surface underneath the electrical lead.

Fluidic dies with beveled edges underneath electrical leads

In some examples, a fluid dispensing die includes a plurality of fluid actuators to cause dispensing of a fluid from respective nozzles of the fluid dispensing die, and an electrically conductive layer including electrically conductive ground structures to connect respective fluid actuators of the plurality of fluid actuators to a ground, wherein the electrically conductive layer includes gaps provided between the electrically conductive ground structures of the electrically conductive layer.

Gaps between electrically conductive ground structures

A fluidic die includes a plurality of fluid chambers, each fluid chamber including an electrode exposed to an interior of the fluid chamber and having a corresponding fluid actuator operating a high voltage separated from the fluid chamber and electrode by an insulating material, and monitoring circuitry, operating at a low voltage, to monitor a condition of each fluid chamber. For each fluid chamber the monitoring circuitry includes a sense node and a conductor connecting the electrode to the sense node, the conductor having a geometry to form at least one region of higher current density relative to remaining portions of the conductor, the at least one region of higher current density to fail and create an open to protect the low-voltage monitoring circuitry in response to a fault current caused by a short circuit of the high voltage fluid actuator to the electrode.

Fluidic die with monitoring circuit fault protection

A conductive wire disposed in a layer is described. An example apparatus includes a die including a silicon layer and a first layer coupled to the silicon layer. The example apparatus a conductive wire disposed in the first layer adjacent a perimeter of a location at which a fluid feed slot is to be formed in the silicon layer. The conductive wire has an electrical characteristic that corresponds to whether the fluid feed slot is defective.

Conductive wire disposed in a layer

In one example in accordance with the present disclosure, a fluid ejection device is described. The fluid ejection device includes a substrate and a number of nozzles formed within the substrate to eject fluid. A number of bond pads are disposed on the substrate and are electrically coupled to the number of rows of nozzles. A termination ring is disposed on the substrate and surrounds the rows of nozzles. The termination ring includes a first metallic layer that is an enclosed shape and a second metallic layer that is disposed on top of the first metallic layer. The second metallic layer includes a gap positioned adjacent the number of bond pads.

Termination ring with gapped metallic layer

In some examples, a heater assembly for a pattern forming system includes a support, and heating elements mounted on the support, where the heating elements are to, in response to activation of the heating element, produce heat directed towards a target to form a pattern on the target. A heat sink is thermally connected to the heating elements and comprising a pattern of heat dissipation surfaces comprising channels to dissipate heat produced by the heating elements.

Dissipating heat of heating elements

A system for isolating a failed resistor in a liquid dispensing system including a fusible links described. The system includes drive circuitry to drive a voltage supply to a resistor. The fusible link is disposed between a field effect transistor (FET) and the resistor. The fusible link is to fuse apart upon failure of the resistor.

Thermal inkjet resistor circuit

A fluid ejecting device including a die including a perimeter defined by a first edge, a second edge opposing the first edge, a third edge, and a fourth edge opposing the third edge, wherein the third and fourth edges are disposed at an angle to the first and second edges to form angular corners, an active area including circuitry for controlling the fluid ejecting device to eject fluid, an inactive area positioned between the perimeter and the active area, and a termination ring encircling the active area, the termination ring including sides extending parallel to the first, second, third, and fourth edges and corners coupling adjacent sides, the corners having a corner radius greater than a first distance between the first edge and one of the sides of the termination ring, and a nozzle to eject fluid.

Fluid ejection device

A fluid ejection device may include a substrate having front and back opposing surfaces and a slot extending through the substrate between the back and front surfaces and along an axis of the substrate. A recessed end region may be formed in the back surface at each end of the slot.

Printhead with recessed slot ends

Isolating failed resistors

A thermal inkjet printhead may include a passivation layer, a bond pad formed over the passivation layer and insulating strips of a dielectric material formed over the passivation layer on opposite sides of the bond pad.

Thermal inkjet printhead

In an embodiment, a method of forming a printhead includes forming on a front-side surface of a substrate, a thin film layer and a plurality of fluidic channels and ejection chambers. The method also includes forming a slot through the substrate from the back-side surface to the front-side surface, where the back-side and front-side surfaces generally oppose one another. The slot has a length extending along a long axis of the substrate and a width extending along a short axis of the substrate. The method includes forming recessed regions into the back-side surface of the substrate at both ends of the slot that extend beyond the length of the slot.

A semiconductor device can include a substrate and a trace layer positioned in proximity to the substrate and including a trace for supplying an electrical connection to the semiconductor device. Conductive layers can be positioned in proximity to the trace layer and form a bond pad. A non-conductive thin film layer can be positioned between the trace layer and the conductive layers. The thin film layer can include a via to enable the electrical connection from the trace to the bond pad. A portion of the trace between the substrate and the plurality of conductive layers can have a beveled edge.

Semiconductor device

Growing community of inventors

Albany, OR, United States of America

Terry E McMahon