Motorola Corporation

Freescale Semiconductor,inc.

Terry E Burnette

Thomas H Koschmieder

Stuart E Greer

David Clegg

Andrew J Mawer

A solder system includes a lead (Pb) indicator and a solder flux. A method for forming a semiconductor device includes providing a carrier, applying the solder system to the carrier, coupling the terminal to the carrier via the solder system, melting the solder system to attach the terminal to the carrier and form a completed semiconductor device, and determining if the completed semiconductor device has a different predetermined property from the solder system.

Lead solder indicator and method

Improved electro-mechanical connections between a packaged semiconductor die () and a printed circuit board () with reduced standoff height and pitch are created by the use of a non-planar semiconductor package substrate () having a surface with angulated portions. Electrically conductive surfaces () are formed over the angulated portions. In one embodiment, the electrically conductive surfaces may be formed by forming an electrically conductive surface () over a non-planar or angulated package substrate (). The electrically conductive angulated surfaces improve reliability of solder joints () upon connecting the packaged semiconductor die to the printed circuit board (). The gaps within the solder mask openings provide a thin profile and improved pitch. In one form, the die may be on a same side of the package as the angulated substrate surface.

Semiconductor package having angulated interconnect surfaces

A semiconductor device ( ) includes a semiconductor die ( ) having electronic circuitry that is connected to a substrate ( ). The substrate ( ) is used to interface the semiconductor die ( ) to a printed circuit board ( ). The substrate ( ) includes a plurality of bonding pads ( ). A first portion of the plurality of bonding pads are soldermask defined (SMD) bonding pads ( ) and a second portion of the plurality of bonding pads are non-soldermask defined (NSMD) bonding pads ( ). Using a combination of SMD and NSMD bonding pads provides the advantages of good thermal cycling reliability and good bending reliability over devices that have only SMD bonding pads or NSMD bonding pads.

Semiconductor device having a ball grid array and method therefor

Multiplexed joining of solder bumps to various substrates for assembly of an integrated circuit package includes placing a semiconductor substrate (312) having solder bump structures (314) in contact with a ceramic substrate (320 having chip pads (322, 334), and placing this structure in contact with ball grid array spheres (352) in order to form a CBGA (360) in a single flow process. The method includes the steps of providing a semiconductor device having at least one first interconnect structure connected to a surface of the semiconductor device (501), and a substrate having a plurality of metallized pads (503); placing an at least one second interconnect structure in aligned contact with one or more of the plurality of metallized pads (505); placing the at least one first interconnect structure in aligned contact with one or more of the plurality of metallized pads (507); and simultaneously reflowing the at least one first interconnect structure and the at least one second interconnect structure such that the semiconductor device and at least one second interconnect structure are connected to the metallized pads of the substrate (509).

Method for multiplexed joining of solder bumps to various substrates

An electrical interconnect structure, including a first component (300), a second component (320), and an electrical interconnect electrically and mechanically interconnecting the first component to the second component, the electrical interconnect including a first solder sphere (314) and a second solder sphere (318) stacked on each other. A semiconductor die (200, 100) that is bumped and packaged utilizing the electrical interconnect structure is also disclosed.

Growing community of inventors

New Braunfels, TX, United States of America

Terry E Burnette