Raytheon Company

Hughes Aircraft Company

Aspen Aerogels, Inc.

Whittaker Corporation

Terry C Cisco

Clinton O Holter

George Leighton Gould

Jason G Milne

Mark S Hauhe

Mary A Teshiba

Craig K Shoda

Joseph N Owens

Kathleen L Virga

Paul Nahass

Nick Zafiropoulos

Algert G Grimaila

Samual D Tonomura

Nick Zafiropoulous

Clifton Ole Holter

A circuit board assembly includes a circuit board, a chip attached to the circuit board and a dielectric layer. The chip has a circuit facing the circuit board and spaced from it. The dielectric layer includes an aerogel. In one embodiment, the aerogel has a dielectric constant of approximately 2.0 or less and a compression strength of at least approximately 100 psi.

Aerogel dielectric layer

Embodiments disclosed include transmission line phase shifters and methods for fabricating transmission line phase shifters that switch signal and ground conductors to reverse electromagnetic fields in a transmission line structure.

Switched path transmission line phase shifter including an off-set twin lead line arrangement

Directional couplers are provided. In one embodiment, the directional coupler includes first and second transmission line segments positioned on a first plane and spaced apart by a first distance, third and fourth transmission line segments positioned on a second plane and spaced apart by a second distance, the second plane spaced apart from the first plane, a first conductive segment connecting the first and third transmission line segments, and a second conductive segment connecting the second and fourth transmission line segments, where the first and second transmission line segments are configured to couple energy therebetween, and where the third and fourth transmission line segments are configured to couple energy therebetween.

Microwave directional coupler

A tunable compact time delay circuit assembly is provided. In one embodiment, the invention relates to a tunable delay circuit assembly for controllably delaying signals that propagate along a transmission line, the circuit assembly including an elongated conductor extending in a first direction, the elongated conductor configured to carry the signals, at least one floating strip, each floating strip including a first elongated conductive segment having a first centerline, wherein the first centerline is not parallel to the first direction, and a second elongated conductive segment having a second centerline, wherein the second centerline is not parallel to the first direction, and a first switch coupled between the first segment and the second segment, wherein the first switch, in a first position, is configured to connect the first segment to the second segment, wherein the first switch, in a second position, is configured to electrically isolate the first segment from the second segment, and wherein the at least one floating strip is electrically isolated from other components of the circuit assembly.

Tunable transmission line time delay circuit having conductive floating strip segments connected by switches

A hybrid assembly having improved cross talk characteristics includes a substrate having an upper surface. Conductive paths on the upper surface are provided for conducting high frequency signals. Regular polygons made of an electromagnetic band gap (EBG) material having slow wave characteristics are deposited on the upper surface and form a lattice for tessellating the upper surface. Each of the polygons has a periphery. The polygons are separated along their periphery from adjacent polygons by an interspace and are covered with an insulating material. Second polygons, also made of an electromagnetic band gap material, are deposited over the insulating material. Semiconductor structures are mounted over the second polygons. The semiconductor structures have a plurality of electrical contacts with the conductive paths. The regular polygons can be hexagons, triangles, octagons or any other combination that forms a lattice and can be printed onto the substrate.

Flip chip MMIC on board performance using periodic electromagnetic bandgap structures

A unitized integrally fused multilayer circuit package having a substrate, walls disposed on the substrate to form a central circuit package cavity, and circuit traces contained in the walls.

Low temperature co-fired ceramic (LTCC) high density interconnect

A multi-sensor radiation detection system for removable insertion into a nuclear reactor wherein one conductor of all the sensors is a single, common element. This single common element is contained within a tubular metallic sheath and in cross-section comprises a multiple radial armed metallic conductor having a star shaped cross-section dimensioned to form wedge-shaped compartments throughout the active radiation detecting length of the metallic sheath.

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Glendale, CA, United States of America

Terry C Cisco