Artesyn Technologies, Inc.

Zytec Corporation

Terry B Solberg

Daryl E Weispfennig

Michael K Hennies

A method and apparatus for dissipating heat from an electrical component. The method includes providing a planar element including a first electrically and thermally conductive region and a second electrically and thermally conductive region, such that the first and second regions define a spacing therebetween, and wherein the planar element includes at least one mechanically stabilizing tie connected between the first and second regions across the spacing, directly connecting a first terminal of an electrical component to the first region, directly connecting a second terminal of the electrical component to the second regions, such that the electrical component bridges the spacing, and removing the at least one mechanically stabilizing tie from between the first and second regions.

Method for fabricating an electrical apparatus

A fastener for mounting a heat sink to a circuit board. The heat sink has a lower surface, at least one groove in the lower surface defining first and second surfaces extending substantially normal to the lower surface, and a lock recess on each of the first and second surfaces. The circuit board has a plurality of openings in a mounting surface thereof The fastener includes a body having a main portion. A spring clip extends in a first direction from the main portion into the groove and is biased to engage the first and second surfaces of the heat sink. A plurality of latches on the spring clip engage the lock recesses when the spring clip engages the first and second surfaces of the heat sink. A plurality of anchor lugs extend in a second direction from the main portion, opposite the first direction, to be received in respective openings in the board to rigidly attach the fastener to the circuit board. Preferably, the anchor lugs are of differing lengths and configurations to permit assembly of the clip to different sized circuit boards. Also preferably, engagement protrusions on the clip engage a concave surface on the heat sink.

Heat sink hold-down clip

A heat sink assembly 10 having a component clip 24 for mounting an electronic component 12. The heat sink body 16 includes a planar mounting surface 26 providing flexible positioning for the component 12. The heat sink body 16 is affixed to the circuit board 14 by a mounting rail 20 providing flexible positioning of the heat sink body 16 on the circuit board 14.

Growing community of inventors

Golden Valley, MN, United States of America

Terry B Solberg