Lam Research Corporation

Terrence George Bernier

Joseph Wei

Chung-Ho Huang

Jeffrey M Simpson

Timothy Scott Thomas

Henry T Chan

Rainer Unterguggenberger

Christopher Thorgrimsson

Allan Matthew Jones

Tony Nguyen

Various embodiments herein relate to a Mixed Reality (MR) control platform to operate a semiconductor manufacturing tool in an MR environment and to display data associated with the semiconductor manufacturing tool. In son embodiments, the MR control platform comprises an MR control system and an MR headset. The MR control system can obtain sensor data representative of sensor output from a semiconductor manufacturing tool. The MR control system can determine operational information associated with the semiconductor manufacturing tool and based on the sensor data. The MR control system can cause the operational information to be transmitted to the MR headset. The MR headset can receive the operational information associated with the semiconductor manufacturing tool from the MR control system. The MR headset can cause content associated with the operational information and one or more control features to be rendered in an MR environment.

Control of semiconductor manufacturing equipment in mixed reality environments

A tool for driving a component with a knurling pattern around an outer surface of the component is provided. A shaft, with a first end, is in the form of at least a partial cylinder, where the at least partial cylinder has a first inner diameter that is less than an outer diameter of the knurling pattern. Serrations in the shaft have a pattern that matches the knurling pattern, which allow the serration in the shaft to engage with the knurling pattern so that when the shaft is rotated, the component is rotated.

Knurling edge driving tool

A tray for storing minimum contact area (MCA) components of a substrate processing system includes a first compartment including at least one of a first lift pin tray and a first plurality of holes. The first lift pin tray includes a plurality of slots configured to retain lift pins of the substrate processing system. The first plurality of holes is configured to receive MCA pins of the substrate processing system. A first cup is arranged adjacent to the first compartment. The first cup includes a wall at least partially surrounding the first cup, the wall separates the first cup from the first compartment, and an upper edge of the wall extends above a bottom surface of the first compartment.

Storing and organizing minimum contact area features and wafer transfer pins during system maintenance

A service cart for storing components of a substrate processing system includes a first side configured to store a transfer plate removed from the substrate processing system. The first side includes a first mount and a second mount that are spaced apart to retain respective upper portions of the transfer plate. Each of the first mount and the second mount includes a respective groove arranged to retain the upper portions of the transfer plate. The first side further includes a first bumper and a second bumper that are spaced apart to abut respective lower portions of the transfer plate. Each of the first bumper and the second bumper are arranged to retain a desired distance between the first side and the lower portions of the transfer plate. A second side of the service cart includes a drawer or an opening to provide access to an interior of the service cart.

Growing community of inventors

Hillsboro, OR, United States of America

Terrence George Bernier