Unisys Corporation

Burroughs, Inc.

Terrence Evan Lewis

Mark DeWayne Bestul

Leonard Harry Alton

Kenneth N Abel

James Dunbar Walker

Ronald Jack Kuntz

John A Nelson

Rex Rice

Stephen A Smiley

Zeev Lipkes

Jeffrey Lokchung Chong

A connector for sending power to an IC-chip thru two pressed joints in series; includes a solid block having a top surface, a bottom surface, and a side with a slot that extends from the top surface to the bottom surface; and 2) a springy strip of metal having a center section which is held by the slot in the block. The springy strip also has a first end section which extends from the center section and includes a springy input contact that is cantilevered above the top surface of the block. The springy strip further has a second end section which extends from the center section and includes a springy output contact that is cantilevered below the bottom surface of the block.

Connector for sending power to an IC-chip thru two pressed joints in series

A connector for sending power to an IC-chip thru four pressed joints in series includes a solid conductive block having a top surface with a first pair of spaced-apart channels and a bottom surface with a second pair of spaced apart channels. The connector also includes a first springy contact having a center section which touches the top surface of the block in the space between the first pair of channels, and having two ends which are held by the first pair of channels. The connector further includes a second springy contact having a center section which touches the bottom surface of the block in the space between the second pair of channels, and having two ends which are held by the second pair of channels.

Connector for sending power to an IC-chip thru four pressed joints in series

A connector for making multiple pressed co-axial connections is comprised of an electrically conductive block which has a top surface, a bottom surface, a plurality of signal holes which extend from the top surface to the bottom surface, and a ground terminal. Top and bottom electrically insulative plates are respectively attached to the top and bottom surfaces of the block. Each plate has alignment holes that are aligned with the signal holes; lying in each signal hole is the body of a respective signal contact; and each signal contact has two springy probes which extend from the body thru respective alignment holes in the top and bottom plates. These springy probes are for contacting external signal pads, and they hold the body of each signal contact such that it is surrounded by a uniform air gap in the center of its respective signal hole.

Connector for making multiple pressed co-axial connections having an air dielectric

Disclosed is a heat sink for cooling an integrated circuit package. The heat sink comprises a single thin sheet of material having two oppositely facing major surfaces. These two major surfaces have a common perimeter defining a plurality of spaced-apart finger-shaped portions of the thin sheet of material that extend radially from a central portion of the sheet. The central portion is convex for attachment to the integrated circuit package; and the finger-shaped portions are formed to extend out of the plane of the central portion to become cooling fins for the central portion.

Integrated circuit package incorporating low-stress omnidirectional heat

A semiconductor device package and a method of making it. A woven fiber mat impregnated with an epoxy adhesive serves as a first housing member. It includes an opening therein for receiving a semiconductor device. The housing member is placed on a supporting heat sink and a lead frame placed on top of the housing member. This subassembly is heated to bond the elements together by curing the epoxy adhesive in the first housing member. A similar second housing member is then placed over the lead frame. The second housing member includes an opening therein which is slightly larger than the opening in the first housing member. A lid is placed on top of the second housing member to cover the opening after the semiconductor device has been bonded to the substrate within the openings in the housing members. The assembly is then again heated to bond the remaining elements together with the epoxy adhesive in the second housing member to form a completed package.

Growing community of inventors

San Diego, CA, United States of America

Terrence Evan Lewis