Shipley Company LLC

Terrell A Benjamin

Michael Gulla

Timothy S Tubergen

Mark Farsi

An electromagnetic radiation attenuating coating comprising an electronic housing base material coating with a first electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus rich in copper and a second electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel land cobalt, and phosphorus rich in nickel. The coating provides superior radiation attenuation and comprises fewer processing steps in its formation.

Radiation attenuation shielding

A process for the metallization of a plastic by electroless deposition, wherein the plastic surface is contacted with a solution useful for the treatment of oxidant residue following contact of the surface with an oxidizing solution such as a hexavalent chromium or permanganate solution. In one embodiment, the solution comprises a reducing agent, a pH adjuster and a surface active agent in a concentration sufficient to reduce the surface tension of the solution preferably to 50 dynes per square centimeter or less at the operating temperature of the solution. In a second embodiment, the solution consists essentially of the surface active agent in a concentration sufficient to achieve the above surface tension range.

Process for metallizing plastics

A process for the metallization of a plastic by electroless deposition, wherein the plastic surface is contacted with a solution useful for the treatment of oxidant residue following contact of the surface with an oxidizing solution such as a hexavalent chromium or permanganate solution. The solution comprises a reducing agent, a pH adjuster and a surface active agent in a concentration sufficient to reduce the surface tension of the solution preferably to 50 dynes per square centimeter or less at the operating temperature of the solution.

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Acton, MA, United States of America

Terrell A Benjamin