Hewlett-packard Development Company, L.P.

Hewlett Packard Enterprise Development LP

Hewlett-packard Company

Terrel L Morris

David Martin Fenwick

Duane A Wegher

Richard John Luebs

Michael Renne Ty Tan

Raymond G Beausoleil

Paul Kessler Rosenberg

Eric C Peterson

Jeffrey D Yetter

Shih-Yuan Wang

Marco Fiorentino

Jeffry D Yetter

Christian Laszlo Belady

Charles Santori

Jason Pelc

David A Fattal

Gary Belgrave Gostin

Daniel Alan Berkram

Richard Stanley Williams

Puneet Sharma

Michael R Tan

Jean Tourrilhes

Mir Ashkan Seyedi

David M Chastain

Anu Mercian

Douglas S Ondricek

Derek Spock

Michael W Cumbie

Kevin B Leigh

Wayne V Sorin

Alexandre M Bratkovski

Norman Paul Jouppi

Sagi Varghese Mathai

Wei Guang Wu

John Norton

Di Liang

Michael S Schlansker

Duncan R Stewart

Jeffrey Clifford Mogul

Moray McLaren

Charles F Clark

Michael R T Tan

Mihail Sigalas

Dwight L Barron

Praveen Yalagandula

Harold Wallace Dozier

Jayaram Mudigonda

Martin Goldstein

Ashkan Seyedi

Paul Anthony Wirtzberger

Martha G Peterson

Guodong Zhang

Steve Belson

Michael C Day

Lisa Heid Pallotti

Colin E Brench

Robert W Skoog

Vic Hong Chia

Christopher M Barnette

Jeffrey D Yatter

Ricahrd John Luebs

Douglas B Fail

Marvin D Ross

Jeffrey N Metcalf

Eric Peterson

Example implementations relate to executing a workload in a computing system including processing devices, memory devices, and a circuit switch. An example includes identifying first and second instruction-level portions to be consecutively executed by the computing system; determining a first subset of processing devices and a first subset of memory devices to be used to execute the first instruction-level portion; controlling the circuit switch to interconnect the first subset of processing devices and the first subset of memory devices during execution of the first instruction-level portion; determining a second subset of the processing devices and a second subset of the memory devices to be used to execute the second instruction-level portion; and controlling the circuit switch to interconnect the second subset of processing devices and the second subset of memory devices during execution of the second instruction-level portion.

Reconfiguration of a computing system using a circuit switch

An optical network includes top networking ports coupled to a packet switch, first media converters, second media converters, and bottom networking ports. The first media converters are coupled to top networking ports, each of the first media converters including a first ASIC transceiver that has a circuit switch function. The second media converters are coupled to the first media converter via optical cables to receive the optical signals. Each of the second media converters includes a second ASIC transceiver that has a circuit switch function. The bottom networking ports are coupled to the second media converters. The first ASIC transceiver and the second ASIC transceiver are configured to transmit a signal from one of the top networking ports to any one of the bottom networking ports, and transmit a signal from one of the bottom networking ports to any one of the top networking ports.

Optical network having combined circuit-packet switch architecture

An optical transceiver module includes an optical transceiver and a controller. The optical transceiver has a ring filter configured to transmit optical signals from or receive optical signals for the optical transceiver module. The controller is configured to: detect a carrier frequency at the optical transceiver; detect a data signal frequency of data at the optical transceiver; determine a bit error rate of the data; and in response to determining that the bit error rate of the data is greater than a threshold, periodically vary a central wavelength of the ring filter at a frequency at least three orders slower than the data signal frequency.

Wavelength modulation for improved optical link bit error rate

Processes and apparatuses described herein provide for an efficient cyclical fiber-optic connection between a source component and multiple destination components in a computing environment. A comb laser generates a laser signal that includes laser light of a first frequency that is red-shifted from a carrier frequency. The comb laser concurrently transmits the laser signal to four ring resonators via an optical waveguide. Three of the ring resonators are initially configured for optical resonance at a second frequency that is blue-shifted from the carrier frequency, while one of the ring resonators is initially configured for optical resonance at the first frequency. The laser signal is modulated to communicate data to a first target location associated with the ring resonator that is initially configured for optical resonance at the first frequency.

Systems for efficient cyclical fiber-optic connections

Wavelength modulation to improve optical link bit error rate

A network packaging system can include a circuit board that includes a chip located substantially in a center of the board. A backplane is in communication with the chip and located along on a first edge of the circuit board. A plurality of connector ports are arranged along the perimeter of at least two other edges of the circuit board. A plurality of traces connects the plurality of connector ports to the chip. A support structure houses one or more circuit boards, with at least two sidewall surfaces of the support structure extending substantially orthogonal to and coextensive with each of the at least two edges of the circuit board. The support structure includes a plurality of apertures extending through the one or more surfaces spatially aligned with each of the plurality of connector ports.

Modular apparatuses and system for backplane connections

A pluggable module is provided for converting an optical signal to a plurality of electrical signals. The pluggable module may include a printable circuit board (PCB) and an optical connector disposed on a first side of the PCB. The optical connector may route any received optical signal to an optical to electrical transceiver. The optical to electrical transceiver may convert the optical signal to an electrical signal and route the electrical signal to an electrical connector mounted on a second, opposite side of the PCB.

Optical to electrical conversion module

Systems and methods for providing full redundancy in a computing network using a single network interface controller (NIC) and a single NIC card within one or more computing devices (e.g., servers) are provided. Embodiments of the technology disclosed herein provide a NIC card with a processing device (e.g., a field-programmable gate array (FPGA)) having a first set of input pins associated with a primary network switch and a second set of input pins associated with a standby network switch. When a failure occurs on the primary network switch, the processing device of the NIC card is configured to perform a circuit switch action to switch the connection between a processing device output from the first set of input pins to the second set of input pins. Accordingly, the same NIC is capable of controlling the network interface of a computing device between to different network switches.

Full server-level redundancy using a single network interface controller(NIC) and a single NIC card

One example includes an apparatus that includes a plurality of input/output (I/O) ports and a body portion. The plurality of I/O ports can be arranged at a plurality of peripheral surfaces of the body portion. The body portion includes a solid dielectric material having a substantially constant index of refraction. The body portion also includes parallel planar surfaces spaced apart by and bounded by the plurality of peripheral surfaces. The solid dielectric material in the body portion can be writable via a laser-writing process to form an optical waveguide extending between a set of the plurality of I/O ports.

Laser-written optical routing systems and method

One example includes an optical fiber interface. The interface includes a first substrate comprising a pair of opposing surfaces. The substrate includes an opening extending therethrough that defines an inner periphery. One surface of the opposing surfaces of the first substrate can be configured to be bonded to a given surface of a second substrate. The interface also includes a plurality of optical fibers secured to the other opposing surface of the first substrate and extending inwardly from a plurality of surfaces of the inner periphery at fixed locations to align the set of optical fibers to optical inputs/outputs (I/O) of an optical system chip that is coupled to the given surface of the second substrate and received through the opening.

Optical fiber interface for optical device package

The present disclosure provides an effective solution to employ hyperscale photonics connectivity using existing server connections. The solution described in the present disclosure eliminates top-of-rack switches and facilitates a manner for servers to connect directly to middle-of-row switches. An apparatus consistent with the present disclosure includes a primary transceiver device. The primary server-end transceiver device comprising a photonics transceiver and a first electrical transmitter. The apparatus further includes a first secondary server-end transceiver device, the first secondary server-end transceiver device comprising a second electrical transmitter. In addition, a first electrical cable electrically couples the primary server-end transceiver to the first secondary server-end transceiver device. The present disclosure enables the use of an input fiber connection and a photonics transceiver to effect two sets of electrical connections on different servers.

Hyperscale photonics connectivity solution

One example includes an optical interconnect device. The optical interconnect device includes a plurality of optical fiber ports coupled to a body portion. The optical interconnect device also includes a plurality of optical fibers that are secured within the body portion. A first portion of the plurality of optical fibers can extend from a first of the plurality of optical fiber ports to a second of the plurality of optical fiber ports, and a second portion of the plurality of optical fibers can extend from the first of the plurality of optical fiber ports to a third of the plurality of optical fiber ports.

Optical interconnect device

A server-to-switch interconnection system that includes a plurality of server modules each having wired server network connection ports, the plurality of server modules being positioned in a server rack. The switch system also includes a rack-level server photonic module that has a plurality of wired network connection ports connecting to a plurality of servers from a single photonic module, an optical transceiver in communication with the wired network connection ports, and an optical port in communication with the optical transceiver.

Rack-level photonic solution

Growing community of inventors

Garland, TX, United States of America

Terrel L Morris