Tactotek Oy

Teknologian Tutkimuskeskus Vtt Oy

Tero Heikkinen

Mikko Heikkinen

Antti Keränen

Jarmo Sääski

Tomi Simula

Vinski Bräysy

Mikko Sippari

Paavo Niskala

Pälvi Apilo

Hasse Sinivaara

Pasi Korhonen

Tapio Rautio

Juha-Matti Hintikka

Heikki Tuovinen

Janne Asikkala

Ville Wallenius

Samuli Yrjänä

Outi Rusanen

Johanna Juvani

Simo Koivikko

Tero Rajaniemi

Taneli Salmi

Suvi Kela

Olimpia Migliore

Juha Sepponen

Sami Torvinen

Jarmo Saaski

Ronald H Haag

Mika Paani

Kimmo Jokelainen

Jan Tillonen

Risto HyypiÖ

Esa-Matti Sarjanoja

Jukka Rautava

Juho Eskeli

Marko Jurvansuu

An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.

Optically functional multilayer structure and related method of manufacture

An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.

Optically functional multilayer structure suitable for large area illumination and related method of manufacture

Optically functionally multilayer structure suitable for large area illumination and related method of manufacture

An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source; the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.

An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.

Multilayer structure and related method of manufacture for electronics

An integrated multilayer structure for hosting electronics, includes a first substrate including organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture. The first substrate has a first side facing a predefined front side of the structure, the first side of the first substrate being optionally configured to face a user and/or use an environment of the structure or of its host device. The first substrate has an opposite second side, a plastic layer, optionally including thermoplastic or thermoset plastics, molded onto the second side of the first substrate so as to at least partially cover it. The first substrate further includes circuitry provided on the second side of the first substrate, wherein the circuitry is at least partially embedded in the molded material of the plastic layer. A related method of manufacture is also presented.

Ecological multilayer structure for hosting electronics and related method of manufacture

Integrated multilayer structure () for hosting electronics, comprising a first substrate () comprising organic, electrically substantially insulating natural material including and exhibiting a related naturally grown or natural textile based surface texture, said first substrate having a first side (A) facing a predefined front side of the structure, said first side of the first substrate being optionally configured to face a user and/or use environment of the structure or of its host device, and an opposite second side (B), a plastic layer (), optionally comprising thermoplastic or thermoset plastics, molded onto said second side of the first substrate so as to at least partially cover it, and circuitry (B) provided on the second side of the first substrate, said circuitry being at least partially embedded in the molded material of the plastic layer. Related method of manufacture is presented.

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Oulunsalo, Finland

Tero Heikkinen