International Business Machines Corporation

Teresita Quitua Magtoto

Gary Walter Behm

Yue J Li

Emily M Hwang

Rajiv M Ranade

Derek C Stoll

Integration of factory level advanced process control (FL-APC) system and tool level advanced process control (TL-APC) system using selectable APC operation modes indicating different operational settings for the FL-APC system and at least one TL-APC system is disclosed. During operation, the FL-APC system controls operation of the TL-APC system. The invention allows a manufacturing execution system (MES) to have additional capability to run the process control functions at FL-APC system and/or TL-APC system, and allows integration of a variety of different tools with a TL-APC system. An implementation method, system and program product are also disclosed.

Factory level and tool level advanced process control systems integration implementation

A method and system for controlling a dimension of an etched feature. The method includes: measuring a mask feature formed on a top surface of a layer on a substrate to obtain a mask feature dimension value; and calculating a mask trim plasma etch time based on the mask feature dimension value, a mask feature dimension target value, a total of selected radio frequency power-on times of a plasma etch tool since an event occurring to a chamber or chambers of a plasma etch tool for plasma etching the layer, and an etch bias target for a layer feature to be formed from the layer where the layer is not protected by the mask feature during a plasma etch of the layer.

Method and system for line-dimension control of an etch process

A computer program product and system of providing a dynamic sampling plan for integrated metrology is disclosed. The computer program product may include a computer readable medium that includes a computer readable program, wherein the computer readable program when executed on a computer causes the computer to: model a sampling plan for use with a factory level advanced processing control (FL-APC) system; receive a request for a sampling plan; and send a recommended sampling plan, based upon the request and the modeling. The recommended sampling plan may be sent to an equipment interface (EI) and on to a tool for implementation in a manufacturing environment.

Providing a dynamic sampling plan for integrated metrology

A method and system of providing a dynamic sampling plan for integrated metrology is disclosed. The method may include modeling a sampling plan for use with a factory level advanced processing control (FL-APC) system and sending a recommended sampling plan, in response to receiving a request for a sampling plan, wherein the recommended sampling plan is based upon the modeling and the request. The recommended sampling plan may be sent to an equipment interface (EI) and on to a tool for implementation in a manufacturing environment.

Method and system of providing a dynamic sampling plan for integrated metrology

Integration of factory level advanced process control (FL-APC) system and tool level advanced process control (TL-APC) system using selectable APC operation modes indicating different operational settings for the FL-APC system and at least one TL-APC system is disclosed. During operation, the FL-APC system controls operation of the TL-APC system. The invention allows a manufacturing execution system (MES) to have additional capability to run the process control functions at FL-APC system and/or TL-APC system, and allows integration of a variety of different tools with a TL-APC system.

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Poughkeepsie, NY, United States of America

Teresita Quitua Magtoto