Raytheon Company

Teresa J Clement

Glafkos K Stratis

Wayne Lee Sunne

Alphonso A Samuel

Alex Dely

Michael Pitman

Delmar L Barker

Frederick B Koehler

Ward D Lyman

Katherine J Herrick

Jeffrey Laroche

Miroslav Micovic

Karen Kaneko Baker

Christopher Carbonneau

An Array Core Block for an AESA includes a stack of 2*M alternating N-channel RFIC and MMIC Power Amplifier wafers bonded together by a wafer-scale direct bond hybrid (DBH) interconnect process. This process forms both metal-to-metal and dielectric hydrogen bonds between bonding surfaces to seal the wafer stack. Each array core block includes an array of through substrate metal vias to distribute DC bias, LO and information signals. Each array core block also includes a cooling system including micro-channels formed on a backside of at least one of the chips in each bonded pair and through substrate via holes formed through the stack that operatively couple the micro-channels for all of the bonded pairs to receive and circulate a fluid through the micro-channels and through substrate via holes to cool the RFIC and MMIC Power Amplifier chips and to extract the heated fluid.

Wafer-scale direct bonded array core block for an active electronically steerable array (AESA)

Ducting and/or duct couplings can be formed from shape memory polymer material, with the material for example being additively manufactured. The use of shape memory polymer material for one or more of the duct portions may allow for easier installation of the ducting, for example allowing the ducting to be warped and/or bent to fit into or through places that are hard to reach or hard to maneuver through, with the ducting then heated to cause it to return to a predetermined memory shape. The coupling of duct portions together may be accomplished by the duct portions including a shape memory polymer material, with for example ends of the duct portions fitted together, and then heated to use a shape memory property of the material to effect coupling. Heating of the shape memory polymer material also softens the material, allowing it to move to a previously set shape.

Duct with shape memory material, and installation method

A reconfigurable polar molecule includes a symmetric nonpolar molecule portion having an elongated shape defined by a longitudinal axis and lateral axis, the longitudinal axis being longer than the lateral axis; a positive ionically charged group at a first end and a negative ionically charged group at a second end of the longitudinal axis, the positive and negative ionically charged groups forming a permanent dipole; a first bridging group and a second bridging group on opposing ends of the lateral axis, the first and second bridging groups being linear nonpolar groups; and a first support portion bonded to the first bridging group, and a second support portion bonded to the second bridging group, the first bridging group and the second bridging group being nonpolar and having structures that enable free rotation of the symmetric nonpolar molecule portion through the first bridging group and the second bridging group.

Solid state materials with tunable dielectric response and rotational anisotropy

A support structure for a reconfigurable molecule includes a first support portion having a first mounting region; a second support portion having a second mounting region; and a rotatable molecule anchored between the first support portion and the second support portion on the first mounting region and the second mounting region, the rotatable molecule having an internal rotational axis extending from the first mounting region to the second mounting region; wherein the first support portion and the second support portion are mirror images of one another.

Method for material packaging and developing rotationally anisotropic materials

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Tucson, AZ, United States of America

Teresa J Clement