Gm Global Technolgoy Operations, Inc.

Terence G Ward

James Michio Nagashima

Edward P Yankoski

Gregory S Smith

Khwaja M Rahman

George John

Scott D Downer

George R Woody

David F Nelson

Brooks S Mann

Marko Jaksic

Alex Thompson

Constantin C Stancu

Nitinkumar R Patel

Khiet Le

Fabio Crescimbini

Federico Caricchi

Steven E Schulz

Silva Hiti

Brian A Welchko

David Yuang Tang

Gabriel Gallegos-Lopez

Dang Dinh Dang

Mark D Korich

George M Claypole

David H Miller

Ronald W Young

Karl David Conroy

Eric R Ostrom

Giorgio Lucchi

Douglas Lee Wickham

Stanley K Fujii

Yunqi Zheng

Bruce Edward Zemke

Duc Q Phan

Milos Stakich

Cheuk S Ng

Chris J Karras

Tilak Gopalarathnam

A power module includes a first circuit structure having a first bus substrate. The first bus structure has a first side on which is disposed a first circuit element. A second circuit structure has a second bus substrate and a second side on which is disposed a second circuit element. The first circuit structure and the second circuit structure are oriented in a stacked configuration such that the first side is disposed facing the second side, and the first circuit element partially overlaps the second circuit element. An output bus is disposed between the first circuit structure and the second circuit structure.

Power module

A power module assembly has a first substrate including a first layer, second layer and a third layer. The first layer is configured to carry a switch current flowing in a first direction. A second substrate is operatively connected to the first substrate and includes a fourth layer, fifth layer and a sixth layer. A conductive joining layer connects the third layer of the first substrate and the fourth layer of the second substrate. The conductive joining layer may be a first sintered layer. The third layer of the first substrate, the first sintered layer and the fourth layer of the second substrate are configured to function together as a unitary conducting layer carrying the switch current in a second direction substantially opposite to the first direction. The net inductance is reduced by a cancellation effect of the switch current going in opposite directions.

Power module assembly with dual substrates and reduced inductance

A power module assembly has a plurality of electrically conducting layers, including a first layer and a third layer. One or more electrically insulating layers are operatively connected to each of the plurality of electrically conducting layers. The electrically insulating layers include a second layer positioned between and configured to electrically isolate the first and the third layers. The first layer is configured to carry a first current flowing in a first direction. The third layer is configured to carry a second current flowing in a second direction opposite to the first direction, thereby reducing an inductance of the assembly. The electrically insulating layers may include a fourth layer positioned between and configured to electrically isolate the third layer and a fifth layer. The assembly results in a combined substrate and heat sink structure. The assembly eliminates the requirements for connections between separate substrate and heat sink structures.

Power module assembly with reduced inductance

Methods are provided for forming/inserting a magnet in a rotor. One method includes coating a plurality of magnetizable particles with a non-metallic material, inserting the coated particles in a rotor, and magnetizing the coated particles. Another method includes inserting a plurality of magnetizable particles into a rotor, submersing the rotor in motor varnish or another viscous, non-metallic material to coat the particles, and magnetizing the particles. Yet another method includes inserting a plurality of magnetizable particles in a rotor, inserting a non-metallic material into the rotor, mixing the particles and non-metallic material to form a mixture, curing the mixture to coat each particle with non-metallic material, and magnetizing the particles. Still another method includes mixing a plurality of magnetizable particles with a non-metallic material, curing the non-metallic material to coat each particle with non-metallic material, inserting the coated particles in a rotor, and magnetizing the coated particles.

Methods for forming a magnet in a rotor

A power converter assembly is provided. The power converter assembly includes first, second, and third power modules. The second power module is coupled to the first power module such that the second power module is separated from the first power module by a first distance. The third power module is coupled to the first and second power modules such that the third power module is separated from the second power module by a second distance and is separated from the first power module by a third distance. The first, second, and third distances are substantially the same.

Power converter assembly with symmetrical layout of power modules

A subcomponent is provided for a power inverter module. The apparatus comprises a capacitor having a terminal and integrated into a housing. A substrate is mounted on the housing. The substrate incorporates a power semiconductor switch and has at least one direct current (DC) tab. The direct current tab is directly connected to the terminal of the capacitor.

Capacitor with direct DC connection to substrate

An automotive power converter is provided. The automotive power converter includes a substrate, first and second electronic devices on the substrate, at least one conductive member coupled to the substrate and having a first device portion electrically coupled to the first electronic device and a second device portion electrically coupled to the second electronic device, and first and second terminals electrically coupled to the at least one conductive member. When a power supply is coupled to the first and second terminals, current flows from the first terminal to the first device portion substantially in a first direction and from the second terminal to the second device portion substantially in a second direction. The first direction has a first component and the second direction has a second component opposing the first component.

Power module layout for automotive power converters

Systems and/or methods are provided for an inverter power module with distributed support for direct substrate cooling. An inverter module comprises a power electronic substrate. A first support frame is adapted to house the power electronic substrate and has a first region adapted to allow direct cooling of the power electronic substrate. A gasket is interposed between the power electronic substrate and the first support frame. The gasket is configured to provide a seal between the first region and the power electronic substrate. A second support frame is adapted to house the power electronic substrate and joined to the first support frame to form the seal.

Inverter power module with distributed support for direct substrate cooling

A semiconductor subassembly is provided for use in a switching module of an inverter circuit for a high power, alternating current motor application. The semiconductor subassembly includes a wafer having first and second opposed metallized faces; a semiconductor switching device electrically coupled to the first metallized face of the wafer and having at least one electrode region; and an interconnect bonded to the semiconductor switching device. The interconnect includes a first metal layer bonded to the at least one electrode region of the semiconductor switching device, a ceramic layer bonded to the first metal layer, the ceramic layer defining a via for accessing the first metal layer, a second metal layer bonded to the ceramic layer, and a conducting substance disposed in the via of the ceramic layer to electrically couple the first metal layer to the second metal layer.

Semiconductor subassemblies with interconnects and methods for manufacturing the same

Systems and apparatus are provided for power electronics substrates adapted for direct substrate cooling. A power electronics substrate comprises a first surface configured to have electrical circuitry disposed thereon, a second surface, and a plurality of physical features on the second surface. The physical features are configured to promote a turbulent boundary layer in a coolant impinged upon the second surface.

Power electronics substrate for direct substrate cooling

A power electronics power module is provided. The power electronics power module includes an electrically conductive substrate, a electronic die having first and second opposing surfaces and at least one transistor formed thereon, the electronic die being mounted to the electrically conductive substrate and the at least one transistor being configured such that when the at least one transistor is activated, current flows from the first surface of the electronic die into the electrically conductive substrate, and a control member at least partially imbedded in the electrically conductive substrate, the control member having a control conductor formed thereon and electrically connected to the at least one transistor such that when a control signal is provided to the control conductor, the at least one transistor is activated.

Power electronics power module with imbedded gate circuitry

A terminal assembly for a power converter is provided. The terminal assembly includes first and second conductive components and a current sensor. The first conductive component has first and second releasable attachment formations. The second conductive component has first and second portions with respective first and second widths. The first width is less than the second width. The first portion is releasably attached to the first conductive component with the second releasable attachment formation. The current sensor has an opening therethrough and is positioned between the first conductive component and the second portion of the second conductive component such that the first portion of the first conductive component extends through the opening. The current sensor is responsive to current flowing through the first portion of the second conductive component.

Compact terminal assembly for power converters

Damping mechanisms and motor assemblies are provided. In an embodiment, by way of example only, a damping mechanism includes an end cap, a bearing retainer plate, a bearing damper ring, a bearing assembly, and first and second lateral dampers. The bearing damper ring is disposed in an annular cavity inwardly from an inner diameter surface of the end cap and has a radially inwardly-extending flange. The bearing assembly is disposed in the annular cavity radially inwardly relative to the bearing damper ring. The first lateral damper is disposed between a radially inwardly-extending wall of the end cap and the bearing damper ring. The second lateral damper is disposed between the bearing damper ring and the bearing retainer plate.

Damping mechanisms and motor assemblies

A stacked busbar assembly includes two or more busbar subassemblies, each including a plurality of busbars having one or more power semiconductor devices bonded thereto (e.g., IGBTs, power diodes, and the like). Each busbar has an internal integrated cooling system including one or more fluid channels in communication with an inlet and an outlet. The busbar assemblies are stacked such that their respective inlets and outlets are aligned and a coolant may then flow in parallel therethrough.

Stacked busbar assembly with integrated cooling

A cooling system is provided for an electric motor and comprises a rotor assembly, an intake assembly, and a first reservoir. The rotor assembly is coupled to and rotatable within a housing, and comprises a rotor having a first and second ends having a first plurality of veins extending therebetween, each vein having an inlet and an outlet. The rotor assembly also comprises a first manifold coupled to and rotatable with the first end of the rotor in fluid communication with the inlets of the first plurality of veins. The intake assembly is coupled to the housing and is in fluid communication with the first manifold. The first reservoir is configured to contain a motor coolant and is coupled to the housing for collecting the motor coolant from the outlets of the first plurality of veins, and for providing a source of motor coolant to the intake assembly.

Growing community of inventors

Redondo Beach, CA, United States of America

Terence G Ward