Growing community of inventors

Palatine, IL, United States of America

Terance B Blake

Average Co-Inventor Count = 3.50

ph-index = 3

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 33

Terance B BlakeGregory Joseph Dunn (4 patents)Terance B BlakeOwen R Fay (1 patent)Terance B BlakeWilliam H Lytle (1 patent)Terance B BlakeBoaz J Super (1 patent)Terance B BlakeHolly Francois (1 patent)Terance B BlakeRemy J Chelini (1 patent)Terance B BlakeTimothy B Dean (1 patent)Terance B BlakePeter Lin (1 patent)Terance B BlakeGregory J Dunn (2 patents)Terance B BlakeEdward Rios (1 patent)Terance B BlakeGeorge A Strumberger (1 patent)Terance B BlakePeter A Lin (0 patent)Terance B BlakeHolly L Francois (0 patent)Terance B BlakePeter A Lin (0 patent)Terance B BlakeHolly L Francois (0 patent)Terance B BlakeTerance B Blake (4 patents)Gregory Joseph DunnGregory Joseph Dunn (52 patents)Owen R FayOwen R Fay (107 patents)William H LytleWilliam H Lytle (28 patents)Boaz J SuperBoaz J Super (17 patents)Holly FrancoisHolly Francois (12 patents)Remy J CheliniRemy J Chelini (8 patents)Timothy B DeanTimothy B Dean (7 patents)Peter LinPeter Lin (4 patents)Gregory J DunnGregory J Dunn (2 patents)Edward RiosEdward Rios (1 patent)George A StrumbergerGeorge A Strumberger (1 patent)Peter A LinPeter A Lin (0 patent)Holly L FrancoisHolly L Francois (0 patent)Peter A LinPeter A Lin (0 patent)Holly L FrancoisHolly L Francois (0 patent)
..
Inventor’s number of patents
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Strength of working relationships

Company Filing History:

1. Motorola Solutions, Inc. (3 from 2,209 patents)

2. Freescale Semiconductor,inc. (1 from 5,491 patents)


4 patents:

1. 9253416 - Modulation of background substitution based on camera attitude and motion

2. 8504640 - Device recruitment for stereoscopic imaging applications

3. 8036716 - Temporary storage or specialized transmission of multi-microphone signals

4. 7078796 - Corrosion-resistant copper bond pad and integrated device

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12/7/2025
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