Tokuyama Corporation

Teppei Ueno

Hiroo Aoki

Keiji Saiki

Masayuki Numata

Provided is silica powder that, when used as a resin filler such as a semiconductor sealant, allows for obtaining a resin composition having excellent gap permeability and low viscosity. The silica powder is such that (1) a cumulative 50% mass diameter Dof a mass-based particle size distribution obtained by a centrifugal sedimentation method is 300 nm to 500 nm (preferably, 330 nm to 400 nm), (2) a loose bulk density is 250 kg/mto 400 kg/m(preferably, 270 kg/mto 350 kg/m), and (3) {(D−D)/D}×100 is 30% to 45%. In a silica production method in which a silicon compound is burned, silica powder can be produced by installing a burner having a concentric multiple pipe structure of three or more pipes in a reactor which has a cooling jacket portion provided around the burner, and adjusting flame combustion conditions and cooling conditions.

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Yamaguchi, Japan

Teppei Ueno