Toyo Kohan Co., Ltd.

Sumitomo Electric Industries, Limited

Teppei Kurokawa

Tatsuoki Nagaishi

Hajime Ota

Takashi Yamaguchi

Kazuya Ohmatsu

Hironao Okayama

Yusuke Hashimoto

Takashi Koshiro

Kouji Nanbu

Kota Sadaki

Kotaro Ohki

Takafumi Hatakeda

Genki Honda

Yoshihiko Isobe

Akira Kaneko

Kazuya Ohmastu

It is an object to provide a substrate for epitaxial growth having a metal base material laminated with a copper layer. On a surface of the copper layer, an area occupied by crystal grains having crystal orientations other than a (200) plane present within 3 μm from the surface can be less than 1.5%. A surface roughness along a same direction as a rolling direction per unit length of 60 μm when measured by AFM can be Ra1<10 nm.

Substrate for epitaxial growth and method for producing same

It is an object of the present invention to provide a roll-bonded laminate controlled in warping and a method for producing the same. The method produces the roll-bonded laminate having a two-layer structure of a first metal layer and a second metal layer, by roll-bonding a first metal plate and a second metal plate, wherein the surface hardness Hv of the first metal plate is lower than the surface hardness Hv of the second metal plate; and the method comprises roll-bonding so as to satisfy the following expression (1):0<(Δ)/≤38  (1)wherein ΔL(mm) represents an elongation amount of the first metal layer with respect to the first metal plate; ΔL(mm) represents an elongation amount of the second metal layer with respect to the second metal plate; and T (mm) represents the total thickness of the roll-bonded laminate.

Roll-bonded body and method for producing roll-bonded body

This invention provides a relatively thick roll-bonded laminate that exhibits a high Erichsen value and excellent molding workability. Such roll-bonded laminate is composed of a stainless steel layer and a non-stainless steel metal layer, and it is characterized in that thickness T is 0.2 mm to 3 mm and a correlation between a proportion Pof thickness Tof the stainless steel layer relative to thickness T and a half width FWHMof a peak exhibiting a crystal plane orientation (200) determined by X-ray diffraction analysis of the stainless steel layer side satisfies the correlation represented by the formula: FWHM&#x2264;0.0057P+0.4.

Roll-bonded laminate

[Problem] To provide: a roll-bonded body which is able to be suppressed in waviness in the surface; and a method for producing this roll-bonded body. [Solution] A roll-bonded body according to the present invention is obtained by bonding a first metal layer and a second metal layer with each other by means of rolling, and is characterized in that the surface of the first metal layer has an arithmetic average waviness (Wa) 0.01-0.96 and a maximum waviness height (Wz) of 0.2-5.0 &#x3bc;m.

Roll-bonded body and method for producing same

It is an object to provide a method for producing a substrate for epitaxial growth having a higher degree of biaxial crystal orientation without forming an irregular part a. The method for producing a substrate for epitaxial growth comprising a step of laminating a metal base material and a copper layer having an fcc rolling texture by surface-activated bonding, a step of applying mechanical polishing to the copper layer, and a step of carrying out orientation heat treatment of the copper layer, wherein the copper layer is laminated in such a way that, when ratios of the (200) plane of the copper layer before laminated and of the copper layer after laminated when measured by XRD are I0and I0, respectively and ratios of the (220) plane of the copper layer before laminated and of the copper layer after laminated are I2and I2, respectively, I0&#x3c;20%, I2=70 to 90%, and I0&#x3c;20%, I2=70 to 90% and I0&#x2212;I0&#x3c;13%.

Substrate for epitaxtail, growth and method for producing same

This invention provides a metal laminate that maintains functionality such as radiation performance and is excellent in dimensional accuracy after press work. Such metal laminate is a roll-bonded laminate composed of 2 or more metal layers, which exhibits a ratio &#x3c3;/T of the standard deviation &#x3c3; of thickness Tof the outermost layer to thickness T of the roll-bonded laminate of 0% of 4.0%, the thickness T of 2 mm or less, and the deviation of the thickness T of 4.0% or less.

Roll-bonded laminate and method for producing the same

This invention provides a roll-bonded laminate composed of a hard copper layer and a stainless steel layer, which is sufficient both in radiation performance and strength. A roll-bonded laminateA is composed of a copper layerA and a stainless steel layerA, in which thickness of the roll-bonded laminateA is 0.02 mm to 0.4 mm, hardness of the copper layerA is 70 Hv or higher, and 180&#xb0; peel strength of the roll-bonded laminateA is 6 N/20 mm or more.

Roll-bonded laminate, method for producing the same, and heat radiation reinforcement member for electronic equipment

It is an objective of the present invention to provide a metal laminate material, which has sufficient strength as well as molding processability, lightweight properties, and radiation performance, which is a metal laminate material that has a two-layer structure of a stainless steel layer and an aluminum layer or a three-layer structure of a 1st stainless steel layer, an aluminum layer, and a 2nd stainless steel layer, wherein tensile strength TS is 200&#x2264;TS&#x2264;550 (MPa), elongation EL is not less than 15%, and a surface hardness Hv of the stainless steel layer is not more than 300 for the metal laminate material.

Metal laminate material and production method therefor

This invention provides a substrate for a superconducting wire used for manufacturing a superconducting wire with excellent superconductivity and a method for manufacturing the same. Such substrate for a superconducting wire exhibits the crystal orientation of metals on the outermost layer, such as a c-axis orientation rate of 99% or higher, a &#x394;&#x3c9; of 6 degrees or less, and a percentage of an area in which the crystal orientation is deviated by 6 degrees or more from the (001) [100] per unit area of 6% or less.

Substrate for superconducting wire, production method therefor, and superconducting wire

An object of the present invention is to provide a production method for efficiently producing a metal laminate having high bonding strength. A method for producing a metal laminate material comprising the steps of: sputter etching faces to be bonded of a stainless steel and an aluminum such that an oxide layer remains on each face; temporarily bonding the faces to be bonded of the stainless steel and the aluminum by roll pressure bonding; and thermally treating the temporarily bonded laminate material at a temperature lower than the recrystallization temperature of the stainless steel to thermally diffuse at least a metal element comprised in the stainless steel into the aluminum.

Method for producing metal laminate material

This invention provides a method for forming an oxide layer on a metal substrate, which enables manufacture of an oxide layer with improved crystal orientation in comparison with that of the outermost layer of a metal substrate. The method for forming an oxide layer on a metal substratevia RF magnetron sputtering comprises a step of subjecting the crystal-oriented metal substrateexhibiting a c-axis orientation of 99% on its outermost layer to RF magnetron sputtering while adjusting the angle &#x3b1; formed by a perpendicular at a film formation positionon the metal substrateand a line from the film formation positionto a pointat which the perpendicular magnetic flux density is zero on the targetlocated at the position nearest to the film formation positionto 15 degrees or less.

Method for forming oxide layer, laminated substrate for epitaxial growth, and method for producing the same

This invention provides a substrate for a superconducting wire used for manufacturing a superconducting wire with excellent superconductivity and a method for manufacturing the same. Such substrate for a superconducting wire has crystal orientation of metals on the outermost layer, such as a c-axis orientation rate of 99% or higher and a &#x394;&#x3c6; of 6 degrees or less, and a percentage of an area in which the crystal orientation is deviated by 6 degrees or more from the (001) [100] per unit area is 6% or less.

Substrate for superconducting wire, method for manufacturing the same, and superconducting wire

An objective of the present invention is to provide a copper substrate for epitaxial growth, which has higher biaxial crystal orientation, and a method for manufacturing the same. The substrate for epitaxial growth of the present invention contains a biaxially crystal-oriented copper layer, wherein the full width at half maximum &#x394;&#x3d5; of a peak based on the pole figure of the copper layer is within 5&#xb0; and the tail width &#x394;&#x3b2; of the peak based on the pole figure is within 15&#xb0; Such a substrate for epitaxial growth is manufactured by a 1step of performing heat treatment of a copper layer so that &#x394;&#x3d5; is within 6&#xb0; and the tail width &#x394;&#x3b2; is within 25&#xb0;, and after the 1step, a 2step of performing heat treatment of the copper layer at a temperature higher than the temperature for heat treatment in the 1step, so that &#x394;&#x3d5; is within 5&#xb0; and the tail width &#x394;&#x3b2; is within 15&#xb0;.

Substrate for epitaxial growth, manufacturing method therefor, and substrate for superconducting wire

A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.

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Kudamatsu, Japan

Teppei Kurokawa