Panasonic Intellectual Property Management Co., Ltd.

Teppei Kojio

Koji Motomura

Takatoshi Ishikawa

Hiroki Maruo

The purpose is, in mounting a semiconductor device onto a substrate, to make it easy to identify the remaining amount of an auxiliary joining agent, to stabilize the dispensing amount of the auxiliary joining agent, and to prevent a shortage of the auxiliary joining agent. Also for the purpose of efficient maintenance of a mounting machine, provided is an auxiliary joining agent adapted to aid joining of metals and prepared by dissolving a colorant in a solvent having a reducing property of removing an oxide film on a metal surface. The auxiliary joining agent is produced by a method including a step of mixing a solvent having a reducing property of removing an oxide film on a metal surface, and a colorant having a property of dissolving in the solvent.

Mounting Method of a semiconductor device using a colored auxiliary joining agent

A method of manufacturing a semiconductor device includes a step of preparing a semiconductor element including a functional surface on which a bump is formed and an adhesive layer of a film shape including a flux component, a step of positioning the semiconductor element above a board including an electrode, a step of activating a flux component by applying ultrasonic vibration to the semiconductor element, a step of bringing the bump into contact with the electrode by pressing the semiconductor element to the board, and a step of bonding the bump to the electrode by continuing the application of the ultrasonic vibration and the pressing of the semiconductor element.

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Yamanashi, Japan

Teppei Kojio