Nissha Co., Ltd.

Teppei Kimura

Hiroaki Suzuki

Kazuo Terasawa

A MEMS gas sensor mount body includes a MEMS gas sensor chip and a printed circuit board. The MEMS gas sensor chip includes a base having a cavity, an insulating film having an opening portion, a gas sensing unit, and a plurality of pads. The printed circuit board includes a gas introduction path, and a plurality of connection terminals. The MEMS gas sensor chip is mounted on the printed circuit board to cover the opening portion, with the cavity and the gas introduction path overlapping in plan view, and with the plurality of pads electrically connected to the plurality of connection terminals. The gas introduction path is provided on the printed circuit board in a region other than a region on which the gas sensing unit is positioned.

MEMS gas sensor mount body

To extend the life of a MEMS gas sensor, the MEMS gas sensor includes an insulator, a gas sensitive material, a first oxide film and an interlayer insulating film, a heater wiring pattern, a lower protective film, and an upper protective film. The insulator includes a cavity. The gas sensitive material is provided corresponding to the cavity. The first oxide film and the interlayer insulating film are provided on the insulator and arranged to overlap each other in a plan view. The heater wiring pattern serves to heat the gas sensitive material and is disposed between the first oxide film and the interlayer insulating film. The lower protective film and the upper protective film cover, in direct contact, an upper surface, a lower surface, and a side surface of the heater wiring pattern.

MEMS gas sensor and method for manufacturing MEMS gas sensor

A package is configured such that a length in a direction parallel to a semiconductor chip is larger than a length in a direction orthogonal to the semiconductor chip, and the package includes a substrate to which the semiconductor chip is electrically connected and fixed, a side wall firmly attached to the substrate, and a cover firmly attached to the side wall. The package includes a detection space in which gas flows around the semiconductor chip. The package includes openings formed in the side wall and/or between the side wall and the cover and communicated with the detection space.

Growing community of inventors

Kyoto, Japan

Teppei Kimura