Panasonic Intellectual Property Management Co., Ltd.

Teppei Kawaguchi

Takuya Yamazaki

Takahiro Noda

Toru Chikuma

Yoshiyuki Hattori

Michiaki Mawatari

In an electronic component mounting method, electronic components are picked up from a component supply unit in which two tray supply mechanisms are arranged, and mounted on substrates. In the method, both of the tray supply mechanisms are allowed to hold trays storing therein the electronic components to be mounted on the substrates. If shortage of the components occurs in one tray supply mechanism during a component mounting process, a target for picking up the electronic components is switched to the other tray supply mechanism. If use stop setting indicating that the pickup of the electronic components is no longer conducted is enabled in one tray supply mechanism, the controller prohibits an access of a mounting head to the one tray supply mechanism, and permits an operation access of an operator to a tray housing unit of the one tray supply mechanism.

Electronic component mounting method

In an electronic component mounting method, electronic components are picked up from a component supply unit in which first and second tray supply mechanisms are arranged, and mounted on substrates. In the method, a first substrate and a second substrate different in type from the first substrate are transported by first and second substrate transport lanes, respectively, and a first component to be mounted on the first substrate and a second component to be mounted on the second substrate are supplied by the first and second tray supply mechanisms, respectively. If use stop setting indicating that the pickup of the electronic components is no longer conducted is enabled in one tray supply mechanism, the controller prohibits an access of a mounting head to the one tray supply mechanism, and permits an operation access of an operator to a tray housing unit of the one tray supply mechanism.

Method of mounting electronic parts

When a connected position detecting unit detects that a connected position of a tape reaches a predetermined position in the tape passage, head-feeding of an electronic component provided in a head of the connected new tape is provided. In the head-feeding, a tape feeder feeds the tape such that the electronic component in the head of the new tape is located in a component pickup port. When the connected position detecting unit detects that the connected position of the tape reaches the predetermined position in the tape passage, a mounting head picks up the electronic component from the new tape fed by the head feeding control unit and is mounted on a new board positioned by a board conveying path.

It is an objective to provide an electronic parts mounting apparatus and an electronic parts mounting method for making it possible to mount various types of electronic parts having equivalent electric characteristics on a single substrate. Before a mount headstarts mounting LED partson substratespositioned by substrate conveyance paths, the number of LED partsstill remaining on a plurality of tape feedersis compared, according to the type of the LED part, with target number of LED partsto be mounted on the substrates. When the number of remaining LED partsof at least one type becomes smaller than the target number of LED partsto be mounted, the mount headis deactivated.

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Yamanashi, Japan

Teppei Kawaguchi