Murata Manufacturing Co., Ltd.

Teppei Akiyoshi

Masahiro Otsuka

Takashi Hiramatsu

Masayuki Ishihara

Takeshi Koga

Katsuhiko Hara

A multilayer ceramic capacitor includes dielectric layers and internal electrode layers provided on the dielectric layers. The dielectric layers each include a perovskite compound that includes Ca and Zr, and optionally Sr and Ti. Mn is disposed at an interface between one of the dielectric layers and one of the internal electrode layers, and a Mn/Zr molar ratio at the interface is not less than about 0.117.

Multilayer ceramic capacitor

A ceramic electronic component includes an electronic component body and portions of first and second metal terminals covered with an outer resin material. The first metal terminal includes, connected in order, a first terminal joint portion, a first extension portion extending in a direction toward a mounting surface, and a first mount portion extending toward a side opposite to the electronic component body. The second metal terminal includes, connected in order, a second terminal joint portion, a second extension portion extending in the direction toward the mounting surface, and a second mount portion extending toward a side opposite to the electronic component body. The first and second mount portions respectively include first and second protrusions protruding toward the mounting surface. The outer resin material includes a protruding portion protruding toward the mounting surface.

Ceramic electronic component and mounting structure therefor

A multilayer ceramic electronic component includes a first metal terminal including a first terminal joining portion connected to a first end surface, a first extending portion connected to the first terminal joining portion and extending toward a mounting surface, and a first mounting portion connected to the first extending portion and extending in a length direction connecting the first end surface and a second end surface; a second metal terminal including a second terminal joining portion connected to the second end surface, a second extending portion extending from the second terminal joining portion toward the mounting surface, and a second mounting portion connected to the second extending portion and extending in a length direction connecting the first end surface and the second end surface. The first and second mounting portions include protrusions protruding toward the mounting surface.

Multilayer ceramic electronic component and mounting structure thereof

A multilayer ceramic electronic component includes a first metal terminal including a first terminal joining portion connected to a first end surface, first and second extending portions extending from both ends of the first terminal joining portion toward a mounting surface, and first and second mounting portions connected respectively to the first and second extending portions in a length direction connecting the end surfaces to each other. A second metal terminal includes a second terminal joining portion connected to the second end surface, a third extending portion extending from the second terminal joining portion toward the mounting surface, and a third mounting portion connected to the third extending portion and extending in a length direction connecting the end surfaces to each other. The first and second mounting portions include first, second, and third protrusion bending portions protruding toward the mounting surface.

A ceramic electronic component includes an electronic component body and portions of first and second metal terminals defined by lead wires covered with an outer resin material. The first metal terminal includes, connected in order, a first terminal joint portion, a first extension portion extending in a direction toward a mounting surface, and a first mount portion extending toward a side opposite to the electronic component body. The second metal terminal includes, connected in order, a second terminal joint portion, a second extension portion extending in the direction toward the mounting surface, and a second mount portion extending toward a side opposite to the electronic component body. The first and second mount portions respectively include first and second protruding bending portions protruding toward the mounting surface. The outer resin material includes a protruding portion protruding toward the mounting surface.

Ceramic electronic component and mount structure therefor

A ceramic electronic component includes a multilayer body, an electronic component main body including first and second outer electrodes on the surface of multilayer body, a first substrate connection terminal bonded to at least one of the first outer electrode and the multilayer body by a bonding material that is electrically insulating, and a first metal terminal electrically connecting the first outer electrode and the first substrate connection terminal, in which, while the first metal terminal maintains an elastically deformed state, a first end portion thereof is bonded to the first outer electrode by an electrically conductive bonding material, and a second end portion thereof is bonded to the first substrate connection terminal by a bonding section with a different melting point from that of the bonding material.

Ceramic electronic component and mounting structure of the same

A dielectric ceramic material comprising the composition: 100(BaCa)TiO+aMnO+bCuO+cSiO+dMgO+eRO (wherein coefficients 100, a, b, c, d, and e each represent mols; m represents the molar ratio of (BaCa) to Ti; and RO represents at least one rare-earth element oxide selected from YO, LaO, 2CeO, NdO, SmO, EuO, GdO, TbO, DyO, HoO, ErO, TmO, YbOand LuO), wherein m, x, a, b, c, d, and e satisfy the relationships: 0.998&#x2266;m&#x2266;1.030, 0.04&#x2266;x&#x2266;0.15, 0.01&#x2266;a&#x2266;5, 0.05&#x2266;b&#x2266;5, 0.2&#x2266;c&#x2266;8, 0.05&#x2266;d&#x2266;3.0, and 0.05&#x2266;e&#x2266;2.5, and the dielectric ceramic material has an average grain size of 0.3 &#x3bc;m to 0.7 &#x3bc;m, is used to make reliable multilayer ceramic capacitors including dielectric ceramic layers each having a small thickness of about 1 &#x3bc;m.

Dielectric ceramic material and multilayer ceramic capacitor

A metal film is made by forming a first non-uniform continuous metal film made of an electroless plating catalyst material on a supporting member using a vacuum thin-film forming method, and then forming a second metal film by electroless plating using the first metal film as a catalyst.

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Nagaokakyo, Japan

Teppei Akiyoshi