Ebara Corporation

Tensei Sato

Jumpei Fujikata

Yuji Araki

Ryuya Koizumi

Hideki Wakabayashi

Kazuma Ideguchi

Yosuke Nagasawa

Shugo Midorikawa

A semiconductor manufacturing apparatus including: a first device; a first calculation circuit that calculates one or more feature quantities of the first device from detected physical quantities; and a failure prediction circuit that determines a portion of model data with a minimum deviation between the measured feature quantities vector comprising the measured one or more feature quantities and a feature quantities vector comprising one or more feature quantities at each time in the plurality of pieces of model data, and calculates a predicted time until failure from a difference between the failure time point in the determined piece of model data and a point in time in the determined piece of model data at which the deviation between the measured feature quantities vector and the feature quantities vector at each time of the plurality of portions of model data is the minimum; and stops the receiving of a new substrate to prevent an introduction of defects on the new substrate.

Semiconductor manufacturing apparatus, failure prediction method for semiconductor manufacturing apparatus, and failure prediction program for semiconductor manufacturing apparatus

In a plating apparatus, a short circuit of a wiring between a rectifier and a plating device is detected without using a substrate in vain. In the plating apparatus that supplies a current from the rectifier to the substrate to plate the substrate, a short circuit detection method includes a step of outputting a current with a predetermined current value from the rectifier, in a state where the substrate and a substrate holder holding the substrate are not electrically connected to the rectifier, a step of acquiring an output voltage value of the rectifier, a step of comparing the output voltage value with a predetermined reference voltage value, and a step of determining that a short circuit occurs in a circuit for connecting the rectifier and the substrate, in a case where the output voltage value is lower than the reference voltage value.

Short circuit detection method in plating apparatus, control method of plating apparatus, and plating apparatus

Provided is a technique configured to cause a first actual operation to be started in a short time when the actual operation of a substrate processing component group is performed a plurality of times. A substrate processing systemincludes a substrate processing apparatushaving a substrate processing component groupand a controller. The substrate processing component groupis configured to perform a test operation and an actual operation. The substrate processing component grouphas a first substrate processing component and a second substrate processing component. When the actual operation is performed a plurality of times, the controllercauses the first substrate processing component to perform the test operation and causes the actual operation of the first substrate processing component to be started after completion of the test operation of the first substrate processing component.

Substrate processing system, controller and method using test operation without substrate

Provided is a semiconductor manufacturing apparatus, comprising: a first device; one or more sensors that detect physical quantities indicating a state of the first device; a first calculation circuit that calculates one or more feature quantities of the first device from the detected physical quantities; and a failure prediction circuit that monitors a temporal change in the one or more feature quantities calculated in the first calculation circuit, and stops receiving a new substrate when a duration for which a degree of deviation of the one or more feature quantities from those at a normal time is increasing exceeds a first time, and/or when a number of increases and decreases per unit time in the degree of deviation of the one or more feature quantities from those at the normal time exceeds a first number.

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Tokyo, Japan

Tensei Sato