The University of Texas System

University of Central Florida Research Foundation Inc

Tengfei Jiang

Paul S Ho

Junjun Liu

Salomon A Stavchansky

Omar Saad Ahmed

A method for isolating at least one conductive via from a surrounding glass substrate is provided. A support layer is formed over at least one surface of the glass substrate. Thereafter, the glass substrate is removed. As a result, the at least one conductive via can be analyzed without interference from the glass substrate.

Method for isolating a conductive via from a glass substrate

Embodiments of the present disclosure include devices, and methods of making such devices, for delivery of one or more active agents with short or long zero-order release kinetics. Embodiments also include implantable or injectable drug delivery systems capable of controlled release over long periods of time for therapeutic agents.

Fabrication methods for nanodelivery systems for long term controlled delivery of active pharmaceutical ingredients

The present disclosure relates to a chip including a wafer, a back-end-of-line (BEOL) layer deposited on the wafer, a chip TSV in the wafer containing a conductive material, and a chip cap layer disposed between the chip TSV and the BEOL layer, and configured to reduce via extrusion of conductive material in the chip TSV during operation of the chip. The present disclosure further includes a 3D integrated circuit including a plurality of electrically connected chips, at least one of which is a chip as described above. The disclosure further relates to a 3D integrated circuit with an interposer, a TSV in the interposer containing a conductive material, and an interposer cap layer configured to reduce via extrusion of the conductive material located in the interposer TSV during operation of the circuit. The present disclosure further includes methods of forming such chips and 3D integrated circuits.

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Orlando, FL, United States of America

Tengfei Jiang