Osram Opto Semiconductors Gmbh

Osram Oled Gmbh

Teng Hai Ocean Chuah

Chui Wai Chong

Seong Tak Koay

Geok Ling Adelene Ng

Choo Kean Lim

An optoelectronic device and a method for producing an optoelectronic device are disclosed. In an embodiment a method includes arranging an optoelectronic semiconductor chip with its top side towards a surface of a carrier, forming a recess at the surface of the carrier such that the recess surrounds the optoelectronic semiconductor chip, arranging a mold compound in the recess and above the surface of the carrier such that the optoelectronic semiconductor chip is embedded into the mold compound, wherein a bottom side of the optoelectronic semiconductor chip remains at least partially not covered by the mold compound, removing the carrier and arranging a wavelength-converting material above the surface of the carrier before arranging the optoelectronic semiconductor chip, wherein the wavelength-converting material is perforated while forming the recess.

Method for producing an optoelectronic device

A method of producing an optoelectronic element with a light emitting component, includes arranging a sacrificial layer at least above a part of a light emitting side of the component, forming at least in a part of an outer surface of the sacrificial layer an inverted optic structure, covering the outer surface of the sacrificial layer by a light transparent layer, transferring the inverted optic structure to an inner side of the transparent layer, and removing the sacrificial layer and forming a gap between the component and the light transparent layer, wherein the light transparent layer includes at the inner side the optic structure.

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Bukit Mertajam, Malaysia

Teng Hai Ocean Chuah