Murata Manufacturing Co., Ltd.

Teiji Yamamoto

Hiroyuki Nagai

Akira Kumada

Kazuhiro Yoshida

Masayuki Aoike

Kansho Yamamoto

Ivo P Koutsaroff

A semiconductor device and a method for manufacturing a semiconductor device that enable characteristics to be improved are provided. A semiconductor device includes a substrate that has a first surface and a second surface that is located opposite the first surface, a first element that is disposed on the first surface, and a first resin layer that is disposed on the first surface and that is disposed around the first element in a plan view. The substrate includes a wiring layer. The first element includes a semiconductor layer, an electrode portion that is located on a surface of the semiconductor layer facing the substrate, and an insulating layer that is located opposite the electrode portion with the semiconductor layer interposed therebetween. The electrode portion is connected to the wiring layer. A height of the first resin layer from the first surface is more than a height of the first element from the first surface.

Semiconductor device and method for manufacturing semiconductor device

A light-emitting-element mount substrate formed by relatively simple manufacturing steps, having a good heat release property, and having a high mechanical strength; and an LED device including the light-emitting-element mount substrate are provided. A substrate body of a light-emitting-element mount substrate is made of a low-resistance semiconductor (e.g., n-type silicon) substrate, and is divided into a first and second individual substrate bodies by an insulating layer. A first front-surface mounting electrode and a first external-connection electrode are formed on respective first and second major surfaces (e.g., front and back surfaces) of the first individual substrate body. A second front-surface mounting electrode and a second external-connection electrode are formed respective first and second major surfaces (e.g., front and back surfaces) of the second individual substrate body. The insulating layer has a shape different from a straight-line shape in plan view.

Light-emitting-element mount substrate and LED device

A piezoelectric actuator that includes a fixed electrode in a base substrate, a dielectric layer on the surface of the base substrate, a lower electrode that is at least partially separated from the base substrate, a piezoelectric layer on the surface of the lower electrode, and an upper electrode on the side of the surface of the piezoelectric layer. At least a portion of the upper electrode or the lower electrode serves as a movable electrode, which can be moved by distortion of the piezoelectric layer caused by application of a piezoelectric drive voltage.

Growing community of inventors

Kyoto, Japan

Teiji Yamamoto