Hitachi Chemical Company, Ltd.

Showa Denko Materials Co., Ltd.

Teiichi Inada

Yasushi Shimada

Kazunori Yamamoto

Michio Uruno

Michio Mashino

Hiroyuki Kuriya

Yasushi Kumashiro

Takayuki Matsuzaki

Keiji Sumiya

Takeo Tomiyama

Yoshiyuki Tsuru

Akira Nagai

Masao Suzuki

Keiichi Hatakeyama

Tetsurou Iwakura

Keisuke Ookubo

Yuuko Tanaka

Aizo Kaneda

Akira Kageyama

Shin Takanezawa

Akishi Nakaso

Hiroyuki Kawakami

Yoshihiro Nomura

Tsuyoshi Morimoto

Hiroshi Kirihara

Ryoji Furutani

Youichi Hosokawa

Yuko Tanaka

Maiko Tanaka

Yoichi Hosokawa

Itsuo Watanabe

Toshiaki Morita

Atsushi Takahashi

Eiichi Ide

Masaaki Yasuda

Shigeharu Arike

Kazuyoshi Kojima

Osamu Watanabe

Kenzo Takemura

Akinari Kida

Kazuhisa Otsuka

Masaya Nishiyama

Haruo Ogino

Hiroto Oda

Koichi Tsuyama

Michiko Kaya

Yuuji Hasegawa

Yoshihiro Tamura

Yuusuke Yasuda

Tetsuro Iwakura

In one aspect, the present invention provides a resin member comprising a copolymer of ethylene and an olefin having 3 or more carbon atoms, and a straight-chain saturated hydrocarbon compound.

Resin member and sheet using same, and heat storage material and heat control sheet using same

In one aspect, the present invention is a resin member comprising a copolymer of ethylene and an olefin having 3 or more carbon atoms, a straight-chain saturated hydrocarbon compound, and a gelling agent.

Resin member and sheet using same, method for producing resin member, and heat storage material and heat control sheet using same

The present invention provides a bonding material and a method of bonding for metal bonding at a bonding interface capable of a higher bonding strength at a lower temperature without application of pressure, compared to a bonding material of metal particles having an average particle size of not greater than 100 nm. An electrically conductive bonding material including (A) silver particles, (B) silver oxide, and (C) a dispersant including organic material containing not more than 30 carbon atoms as essential components, wherein a total amount of (A) the silver powder, (B) the silver oxide powder, and (C) the dispersant including an organic material containing not more than 30 carbon atoms is in a range of 99.0% to 100% by weight, is provided. In other words, no resin binder is contained.

Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same

The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100&#xb0; C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing tape integrated type adhesive sheet formed by lamination of the adhesive sheet and a dicing tape; and a method of producing a semiconductor device using them. In order to achieve this object, the invention is characterized by specifying the breaking strength, breaking elongation, and elastic modulus of the adhesive sheet in particular numerical ranges.

Adhesive sheet, dicing tape integrated type adhesive sheet, and method of producing semiconductor device

An adhesive sheet comprising a release substrate, a substrate film, and a first tacky-adhesive layerplaced between the release substrateand the substrate film, wherein an annular incision D is formed on the release substratefrom the surface of the first tacky-adhesive layerside, the first tacky-adhesive layeris laminated so as to cover the whole inner surface of the incision D in the release substrate, and the incision D has a depth d of less than the thickness of the release substrateand 25 &#x3bc;m or less.

Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device

Disclosed is an adhesive composition which includes (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally includes (d) a filler and/or (e) a curing accelerator. Also disclosed are a process for producing an adhesive composition, including mixing (a) the epoxy resin and (b) the curing agent with (d) the filler, followed by mixing the resultant mixture with (c) the polymer compound incompatible with the epoxy resin; an adhesive film including the above-mentioned adhesive composition formed into a film; a substrate for mounting a semiconductor including a wiring board and the above-mentioned adhesive film disposed thereon on its side where chips are to be mounted; and a semiconductor device which includes the above-mentioned adhesive film or the substrate for mounting a semiconductor.

Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device

An object of the present invention is to provide an adhesive sheet that can fill irregularities due to wiring of a substrate or a wire attached to a semiconductor chip, etc., does not form resin burrs during dicing, and has satisfactory heat resistance and moisture resistance. The present invention relates to an adhesive sheet comprising 100 parts by weight of a resin comprising 15 to 40 wt % of a high molecular weight component containing a crosslinking functional group and having a weight-average molecular weight of 100,000 or greater and a Tg of &#x2212;50&#xb0; C. to 50&#xb0; C., and 60 to 85 wt % of a thermosetting component containing an epoxy resin as a main component, and 40 to 180 parts by weight of a filler, the adhesive sheet having a thickness of 10 to 250 &#x3bc;m.

Adhesive sheet, semiconductor device, and process for producing semiconductor device

An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and being used in both a dicing step and a semiconductor element adhesion step, wherein the adhesive bonding layer comprises:

Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device

An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and being used in both a dicing step and a semiconductor element adhesion step, wherein the adhesive bonding layer comprises: a polymer component (A) having a weight average molecular weight of 100,000 or more including functional groups; an epoxy resin (B); a phenolic epoxy resin curing agent (C); a photoreactive monomer (D), wherein the Tg of the cured material obtained by ultraviolet light irradiation is 250&#xb0; C. or more; and a photoinitiator (E) which generates a base and a radical by irradiation with ultraviolet light of wavelength 200-450 nm.

Adhesive bonding sheet, semiconductor device using same, and method for manufacturing such semiconductor device

Dicing tape laminated with adhesive sheet of polymer, epoxy resin and filler

Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler

Semiconductor device by adhering circuit substrate with adhesive film of epoxy resin, phenolic resin and incompatible polymer

Bonding semiconductor wafer stuck on dicing tape laminated adhesive sheet onto mounting support

Provided is a resin molding material having a remarkably excellent abrasion resistance while maintaining a favorable mechanical strength. The resin molding material is improved in deterioration of the abrasion resistance caused by an abrasive powder generated from an inorganic substance, particularly from a glass fiber or the like. The resin molding material contains a resin, a carbon substance and an inorganic substance. The carbon substance contains an adhesive carbon substance.

Resin molding material

Growing community of inventors

Tsukuba, Japan

Teiichi Inada