Intel Corporation

Ted Zarbock

Gary A Brist

Tom Ruttan

Modification of the connections between a die package and a system board is described. In one example a pattern redistribution module is used in a socket. The module has a first array of contacts on one side of the module. The contacts have a first configuration to connect to the socket. A second array of contacts is on another side of the module opposite the first array of contacts and has a second configuration to connect to a package containing a die. A board is between the first and the second array of contacts to interconnect contacts of the first array of contacts to contacts of the second array of contacts.

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Gilbert, AZ, United States of America

Ted Zarbock