Sun Chemical Corporation

Ted Kreutz

Jarol Osorio

Maura Mostowy-Gallagher

Kyle Hill

Joel Garcia

Graham Robins

Jin-An He

Monica Liu

Described herein are printing ink compositions suitable for printing of microwavable flexible packaging. The printed black ink exhibits low microwave energy absorption, thus minimizing the risk of charring, arcing, ignition, distortion or burning during microwave heating processes. Nitrocellulose resin, a solvent, a polyurethane resin, and a carbon black pigment having at least one of an imaginary permittivity of &#x2264;3, preferably &#x2264;2, and a surface oxygen content of 1 wt % to 3 wt %, preferably 1.5 wt % to 2.5 wt % are among the components of the printing ink compositions. Also described is packaging suitable for exposure to microwave energy upon which the inks have been printed.

Microwavable solvent-based packaging ink composition

Compositions used in, and methods for, fabricating a rear-passivated silicon solar cell are described. A novel method of opening the back surface for contacting the silicon with a conventional aluminum paste is described. Various novel screen printable etch resists are described. First, such an etch resist can be printed on the rear of a rear-passivated solar cell wafer. The passivation layer can then be removed using a wet etch, and next the etch resist layer can be removed. Further, an additional wet etch step may optionally be used to deepen the opening into the silicon and enhance the BSF (back-surface field). Aluminum paste can then be printed over the entire backside of the now etched cell. The entire cell is then fired. In exemplary embodiments of the present invention, the paste can be chosen so that it will not fire through the passivation layer.

Compositions and processes for fabrication of rear passivated solar cells

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Roseland, NJ, United States of America

Ted Kreutz