Micron Technology Incorporated

Teleflex Life Sciences Pte. Ltd.

Teleflex Life Sciences Unlimited Company

Teck Poh

Choon Kuan Lee

Wuu Yean Tay

Kian Chai Lee

Cher Khng Victor Tan

Guek Har Lim

Cheng Pour Poh

Cheng Poh Pour

Sylwia Poulsen

An endoscopy device () for facilitating use of an endoscope, comprising at least one airway tube () and a mask () having a distal end (), a proximal end () and a peripheral formation &#x3be;&#x3b2;) capable of conforming to, and fitting within, the actual and potential space behind the larynx of the patient to form a seal around the circumference of the laryngeal inlet, the peripheral formation () establishing separation between a laryngeal; chamber side () and a pharyngeal side (), the device further comprising a conduit () adapted for passage of an endoscope into the oesophagus of a patient when mask () is in place, conduit () including a distal end for cooperation with the oesophageal sphincter, the conduit having a laryngeal side (), a pharyngeal side (), a right side () and a left side (), and an outlet wherein at the outlet the width between the left side and the right side is smaller than the width of the conduit.

Endoscopy device

A method for designing a carrier substrate includes configuring at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The method may also include configuring the carrier substrate to include one or more recessed areas that laterally surround at least a portion of the die-attach location to receive excess adhesive.

Methods for designing carrier substrates with raised terminals

A solder mask for use on a carrier substrate includes a device-securing region positionable over at least a portion of a die-support location of the carrier substrate. Dams of the solder mask are positionable laterally adjacent to at least portions of the peripheries of corresponding terminals of the carrier substrate. A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. The solder may be positioned or formed on the carrier substrate. The carrier substrate and solder mask may each include one or more recessed areas that laterally surround at least portions of their die-attach location and device-securing region, respectively, to receive excess adhesive.

Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks

A carrier substrate includes at least one die-attach location and one or more terminals that protrude from a surface of the carrier substrate so as to prevent adhesive material from contaminating connection surfaces thereof. A solder mask for use on a carrier substrate includes a device-securing region positionable over at least a portion of a die-support location of the carrier substrate. Dams of the solder mask are positionable laterally adjacent to at least portions of the peripheries of corresponding terminals of the carrier substrate. The carrier substrate and solder mask may each include one or more recessed areas that laterally surround at least portions of their die-attach location and device-securing region, respectively, to receive some of the excess adhesive. Assemblies and packages including one or both of the carrier substrate and solder mask are also disclosed, as are assembly methods and methods for designing the carrier substrate and solder mask.

Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks, and methods

Solder masks for use on carrier substrates, carrier substrates and semiconductor device assemblies including such solder masks

Growing community of inventors

Singapore, Singapore

Teck Poh