Lite-on Singapore Pte. Ltd.

Teck-Chai Goh

Sin-Heng Lim

Guang-Li Song

Yu-Chou Lin

You-Fa Wang

Yi Zhang

Suresh Basoor Nijaguna

Arakcre Dinesh Gopalaswamy

Chien-Hsiu Huang

Rui-tao Zheng

Soon-Lee Tan

Guo-Jun Xu

Wei Jian Jenson Neo

Kun-Lung Lee

Yu-Hsien Liu

A proximity sensor includes a substrate, an emitting unit, a receiving unit, a packaging unit and an isolating unit. The emitting unit is disposed on an emitting region of the substrate. The receiving unit is disposed on a receiving region of the substrate. The packaging unit includes a first package body and a second package body. The first package body covers the emitting unit, and the second package body covers the receiving unit. The isolating unit is disposed between the first package body and the second package body. The first package body has a first top surface and a first side surface connected to the first top surface. The light can be emitted out the first top surface or the first side surface, respectively received by a second side surface or the second top surface of the second package body, and detected by the receiving unit.

Proximity sensor and electronic device having the same

An optical sensing apparatus includes a base, and an emitter and a detector that are respectively disposed on the base. A package structure covers the emitter and the detector, a first recess portion divides the emitter and the detector, and a second recess portion is located on the detector. A scattering path of light generated by the emitter is altered by the first recess portion and the second recess portion.

Optical sensing apparatus comprising a package structure with a recess portion through which a scattering path of light is altered

A manufacturing method of an optical sensor package includes: disposing a chip on a circuit board, the chip including a light emitting area and a light receiving area; disposing at least one light emitting element, which is electrically connected to the circuit board, on the light emitting area of the chip; coating a light blocking material between the light emitting area and the light receiving area; filling a light permeable material that covers the circuit board, the chip, the light blocking material, and the at least one light emitting element; removing a part of the light permeable material disposed between the light emitting area and the light receiving area, forming a first recess and expose the light blocking material; and filling an anti-light-leakage material in the first recess, to form a lateral light blocking structure through stacking the anti-light-leakage material and the light blocking material.

Optical sensor package and manufacturing method for the same

A manufacturing method of an optical module is provided and includes: attaching a light emitting diode light emitting device and a sensor on a substrate; disposing a first encapsulation portion on the light emitting device and the substrate; disposing a second encapsulation portion on the sensor and the substrate; disposing a shielding layer on the first encapsulation portion, the second encapsulation portion and the substrate; removing a first portion of the first encapsulation portion, a second portion of the second encapsulation portion, and a third portion of the shielding layer, and the first portion corresponds to a position of the light emitting device, the second portion corresponds to a position of the sensor, and the third portion corresponds to the positions of the light emitting device and the sensor; and forming a third encapsulation layer on the shielding layer, the first encapsulation portion and the second encapsulation portion.

Manufacturing method of an optical module

The instant disclosure provides a wafer level sensing module and a manufacturing method thereof. The wafer level sensing module includes a chip substrate, a proximity sensing unit, and an ambient light sensing unit. The proximity sensing unit is disposed on the chip substrate and includes an emitter, a first receptor, and a shielding assembly. The shielding assembly includes a first shielding member, a second shielding member, a third shielding member, a first lens, and a second lens. The ambient light sensing unit is disposed on the chip substrate and is separate from the proximity sensing unit. The ambient light sensing unit includes a second receptor and a transparent shielding plate. The first receptor and the second receptor are formed on the chip substrate and exposed from a top surface of the chip substrate, and the transparent shielding plate corresponds in position to the second receptor.

Wafer level sensing module

A proximity sensor and a mobile device using the same are provided. The proximity sensor includes a circuit board, an emitter package, a receiver package, a plastic casing and a lens. The emitter package is disposed on the circuit board and includes an emitter and an emitter housing. The receiver package is disposed on the circuit board and includes a receiver and a receiver housing. The plastic casing covers the emitter package and the receiver package. The plastic casing includes a first opening corresponding to the emitter package and a second opening corresponding to the receiver package. The first opening has a first geometric centerline and the second opening has a second geometric centerline. The height of the emitter package is smaller than that of the receiver package, and the emitter is disposed between the first geometric centerline and the second geometric centerline.

Proximity sensor and mobile device using the same

A detection device and a method of manufacturing the same are disclosed. The detection device includes a detection module and a housing module disposed on the detection module. The detection module includes a substrate, an emission unit, and a detection unit. The substrate includes an emission end area on which the emission unit is disposed, and a receiver end area on which the detection unit is disposed. The housing module includes a plastic housing unit having a receiving space and an opening, and a metallic shielding unit disposed on the plastic housing unit. The receiving space is divided into a first receiving space and a second receiving space by the metallic shielding unit, and the opening is divided into an emission hole and a detection hole by the metallic shielding unit. By the above-mentioned means, the distance between the emission hole and the detection hole is reduced.

Detection device and method of manufacturing the same

A method for manufacturing a sensor unit includes the steps of: Step 1 is providing a substrate having sensor unit areas. Each sensor unit area is partitioned into two individual circuit areas. A signal emitting device and a signal detecting device are respectively disposed on the two circuit areas. Step 2 is forming a packaging structure to cover the two circuit areas, the signal emitting device, the signal detecting device, and a cutting area between the two circuit areas using a mold. Step 3 is cutting the packaging structure along the cutting area to form a separation cut groove. Step 4 is assembling a separation member onto each sensor unit area. The separation member is disposed on the separation cut groove so that the signal emitting device and the signal detecting device on the same sensor unit area are isolated from each other.

Method for manufacturing sensor unit

An integrated Sensing package structure includes a substrate made of IR blocking material. The substrate has a first receiving compartment and a second receiving compartment concavely formed on the top surface thereof. The first receiving compartment has a reflective layer formed on the surface of the inner wall thereof. A LED unit is disposed in the bottom portion of the first receiving compartment. A plurality of first conducting lines is electrically connected to the LED unit and extends to an outer surface of the substrate. An IR sensing chip is disposed in the second receiving compartment. A plurality of second conducting lines is electrically connected to the IR sensing chip and extends to an outer surface of the substrate. An IR block cover is covered on the top surface of the substrate, forming at least one opening corresponding to the IR sensing chip.

Growing community of inventors

Singapore, Singapore

Teck-Chai Goh