Samsung Electronics Co., Ltd.

Teaseog Um

Seunghee Lee

Chulmin Kim

Yisung Hwang

Yongdae Ha

Suklae Kim

Guiheum Choi

Jaeryoung Lee

Yongjin Jung

Minsu Kang

Insik Kim

Yoonoh Han

The die bonding apparatus including a transferring unit, a loading member loading a substrate to the transferring unit, an unloading member unloading the substrate from the transferring unit, a wafer holder supporting a wafer providing dies, and a bonding member picking up one of the dies from the wafer and bonding the picked-up die to the substrate loaded on the transferring unit by pressuring the picked-up die against the substrate using a gas may be provided.

Die bonding apparatus

An insert for a semiconductor package testing apparatus comprises a body having a pocket constructed and arranged to receive the semiconductor package, and a sliding tool slidingly positioned on the body. The sliding tool is constructed and arranged to open and close the pocket as a result of a sliding motion of the sliding tool relative to the body.

Insert for semiconductor package and testing apparatus with the same

A semiconductor chip package test socket may include a socket housing; a plurality of probe needles in the socket housing; a conductive pad on the probe needles; a floating guide configured to cover an edge of the conductive pad and configured to provide a semiconductor chip package on the conductive pad; and/or clamps fixed at the socket housing. The clamps may combine the floating guide with the socket housing.

Test socket having a housing with clamping devices to connect the housing to a floating guide

Growing community of inventors

Asan-si, South Korea

Teaseog Um