Samsung Electronics Co., Ltd.

Teak-hoon Lee

Pyoung-Wan Kim

Chul-Yong Jang

Jong-Ho Lee

Eun-Chul Ahn

Sang-Sick Park

Dong-hyeon Jang

Chul-yong Jang

Jung-Seok Ahn

Sung-jun Im

Ho-geon Song

Chang-seong Jeon

A method of manufacturing a chip-stacked semiconductor package, the method including preparing a base wafer including a plurality of first chips each having a through-silicon via (TSV); bonding the base wafer including the plurality of first chips to a supporting carrier; preparing a plurality of second chips; forming stacked chips by bonding the plurality of second chips to the plurality of first chips; sealing the stacked chips with a sealing portion; and separating the stacked chips from each other.

Method of manufacturing chip-stacked semiconductor package

In one embodiment, a semiconductor package includes a first insulating body and a first semiconductor chip having a first active surface and a first back surface opposite the first active surface. The first semiconductor chip is disposed within the first insulating body. The first active surface is exposed by the first insulating body. The first back surface is substantially surrounded by the first insulating body. The semiconductor package includes a post within the first insulating body and adjacent to a side of the first semiconductor chip.

Semiconductor package having buried post in encapsulant and method of manufacturing the same

A semiconductor chip package including a semiconductor chip including a first surface having bonding pads, a second surface facing the first surface, and sidewalls; a molding extension part surrounding the second surface and the sidewalls of the semiconductor chip; redistribution patterns extending from the bonding pads over the molding extension part, and electrically connected to the bonding pads; bump solder balls on the redistribution patterns; and a molding layer configured to cover the first surface of the semiconductor chip and the molding extension part, while exposing portions of each of the bump solder balls. The molding layer has concave meniscus surfaces between the bump solder balls adjacent to each other.

Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device

Growing community of inventors

Gyeonggi-do, South Korea

Teak-hoon Lee