Altek Biotechnology Corporation

Te-Yu Chung

Chao-Yu Chou

Fang-Mentg Kuo

An endoscopic image capturing assembly is provided and includes a holder, an image sensing device, a conducting track, a cable and a lens set. The holder includes a first surface and a second surface perpendicular to the first surface. The image sensing device is mounted on the first surface and includes an electrical connecting component. The conducting track is formed from the first surface to the second surface of the holder and electrically connected to the electrical connecting component. The cable is mounted on the second surface. A terminal of the cable is electrically connected to the electrical connecting component of the image sensing device by the conducting track. The lens set is assembled with the image sensing device. An optical axis of the lens set is parallel to an extending direction of the cable. Furthermore, a related endoscopic device is provided.

Endoscopic image capturing assembly and endoscopic device therewith

An image capturing assembly is provided and includes a fixture, a lens assembly, an image sensing device and a circuit board. The fixture includes a fixture body and at least one first contact. An accommodating space is formed on the fixture body. The at least one first contact is disposed on the fixture body. The lens assembly is engaged with the fixture body. The image sensing device is disposed inside the accommodating space. The image sensing device includes at least one second contact electrically connected to the at least one first contact. The circuit board includes a board body and at least one third contact. The board body is perpendicular to and affixed with the fixture body. The at least one third contact is disposed on the board body and electrically connected to the at least one first contact. Besides, a related endoscope is further provided.

Image capturing assembly and related endoscope

A wire soldered structure includes a substrate including a main body, a first conducting layer disposed on the main body, and a through hole extending through the main body and the first conducting layer; a wire including a soldered portion that is disposed on the first conducting layer and that is adjacent to the through hole; and a solder disposed in the through hole; wherein the soldered portion of the wire is soldered to the first conducting layer of the substrate via the solder.

Growing community of inventors

Hsinchu, Taiwan

Te-Yu Chung