D-link Corporation

Alpha Networks Inc.

Te-Wei Liu

Ying-Hui Huang

Ching-Rong Ko

Tien-Hsiung Tung

Yuh-Shuan Chang

Pao-Kang Mo

This invention discloses a network device including at least one rail element disposed at both sides of the network device at positions adjacent to the rear of the network device respectively to form a slide rail on each side, and two fixing elements each having a locking portion and a support portion, wherein the locking portion has at least one locking hole and is coupled perpendicularly to the support portion, such that when the network device is installed in a rack and the front of the network device is fixed to the front of the rack, each support portion can be extended into each corresponding slide rail, and each locking portion can be secured to the rear of the rack through each corresponding locking hole.

Network device fixture

The present invention relates to a server device which comprises a case having two symmetric slots disposed on the top and a first handle disposed in each of the slots to make it easier to lift up the server device, a horizontal partition disposed in the case and dividing the inner space of the case into upper and lower parts, wherein the upper part is a first holding space capable of holding at least an electronic device, a first heat dissipation unit is disposed at the front of the electronic, the lower part of the case is a second holding space capable of holding at least a server, and a second heat dissipation unit may be disposed at one side of the second holding space, such that a plurality of servers, electronic devices and heat dissipation units may be integrated into the server device for easily and conveniently being moved.

Server device

A heat sink assembly including a heat sink having a plurality of equi-distantly spaced cooling fins. The heat sink body has a depression on one side for receiving a cooling and is fixedly provided above integrated circuits of the electronic product, with a layer of thermal conductive plate disposed therebetween. The heat generated by the integrated circuit elements during operation process is transferred to the cooling fins via the thermal conductive plate. Simultaneously, the cooling fan draws in air, which is discharged, via an air outlet thereof towards the cooling fins to dissipate the heat of the cooling fins. The cooling fan can be disposed directly above the heat sink body to enhance heat dissipation efficiency. A single cooling fan will suffice to achieve good heat dissipating effects, thus reducing manufacturing cost.

Heat sink assembly for an electronic device

A MAU mounting structure including a network device mainframe having a slot at one side and an electric connector inside the slot, a mounting case slidably mounted in the slot of the mainframe, having a top recess and two retaining notches at the back side and two curved finger strips bilaterally disposed at the front side for pulling with the hand, and a multi-station access unit mounted within the mounting case, the multi-station access unit having an electric connector supported on the top recess of the mounting case and adapted for connecting to the electric socket of the network device mainframe, two fastening devices disposed at two opposite sides of the electric connector of the multi-station access unit and adapted for securing the multi-station access unit to the mounting case, the fastening devices having a respective neck adapted for coupling to the retaining notches of the mounting case.

Growing community of inventors

Hsinchu, Taiwan

Te-Wei Liu