Ememory Technology Inc.

Ipcell Corporation Limited

Te-Hsun Hsu

Wei-Ren Chen

Hsin-Ming Chen

Wen-Hao Ching

Ching-Sung Yang

Wen-Hao Lee

Hsuen-Wei Chen

Shih-Chen Wang

Chih-Hsin Chen

Chun-Hsiao Li

Ying-Je Chen

Mu-Ying Tsao

Wen-Chuan Chang

A memory device comprises a memory cell comprising first to third transistors and a fuse element. A control terminal and a first terminal of the first transistor are coupled to a write word line and a source line respectively. The second transistor has a control terminal coupled to a second terminal of the first transistor and a first terminal coupled to a bit line. A first terminal of the fuse element is coupled to the second terminal of the first transistor and the control terminal of the second transistor. A control terminal of the third transistor is coupled to a read word line. First and second terminals of the third transistor are coupled to the source line and a second terminal of the second transistor. The first transistor is turned on to form a write path and the second and third transistors form a read path.

Memory device, integrated circuit and manufacturing method of the same

A method for manufacturing a semiconductor structure includes forming a first dielectric layer on a substrate; forming a second dielectric layer on the first dielectric layer; using a photomask to apply a photoresist to cover a first part of the second dielectric layer; removing a second part of the second dielectric layer while retaining the first part of the second dielectric layer; and removing the photoresist. The first part of the second dielectric layer covers a first part of the first dielectric layer in a first area. The second part of the second dielectric layer covers a second part of the first dielectric layer in a second area. The first area is corresponding to a memory device. The second area is corresponding to a logic device.

Method for manufacturing semiconductor structure and capable of controlling thicknesses of dielectric layers

A non-volatile memory including following elements is provided. The floating gate transistor, the select transistor and the stress-releasing transistor are disposed on the substrate and coupled in series with each other. The stress-releasing transistor is located between the floating gate transistor and the select transistor. The stress-releasing transistor has a stress release ratio represented by formula (1). A lower limit value of the stress release ratio is determined by a sustainable drain side voltage of the stress-releasing transistor of the non-volatile memory which is unselected when a program operation is performed. An upper limit value of the stress release ratio is determined by a readable drain current of the non-volatile memory which is selected when a read operation is performed.The stress release ratio=a channel length of the stress-releasing transistor/a gate dielectric layer thickness of the stress-releasing transistor&#x2003;&#x2003;(1).

Non-volatile memory with protective stress gate

A nonvolatile memory cell includes a semiconductor substrate, a first OD region, a second OD region, an isolation region separating the first OD region from the second OD region, a PMOS select transistor disposed on the first OD region, and a PMOS floating gate transistor serially connected to the select transistor and disposed on the first OD region. The PMOS floating gate transistor includes a floating gate overlying the first OD region. A memory P well is disposed in the semiconductor substrate. A memory N well is disposed in the memory P well. The memory P well overlaps with the first OD region and the second OD region. The memory P well has a junction depth that is deeper than a trench depth of the isolation region. The memory N well has a junction depth that is shallower than the trench depth of the isolation region.

Highly scalable single-poly non-volatile memory cell

A non-volatile memory including a substrate, a floating gate transistor, a select transistor and a stress-releasing transistor. The floating gate transistor, the select transistor and the stress-releasing transistor are disposed on the substrate and coupled in series with each other. The stress-releasing transistor is located between the floating gate transistor and the select transistor.

Non-volatile memory

A nonvolatile memory structure included a P substrate, an N well in the P substrate, and a PMOS storage transistor. The PMOS storage transistor includes a floating gate and an auxiliary gate disposed in close proximity to the floating gate. The floating gate and the auxiliary gate are disposed directly on the same floating gate channel of the PMOS storage transistor. A gap is provided between the auxiliary gate and the floating gate such that the auxiliary gate and the floating gate are separated from each other at least directly above the floating gate channel.

Nonvolatile memory structure

An erasable programmable single-poly nonvolatile memory includes a substrate structure; a first PMOS transistor comprising a select gate, a first source/drain region, and a second source/drain region, wherein the select gate is connected to a select gate voltage, and the first source/drain region is connected to a source line voltage; a second PMOS transistor comprising the second source/drain region, a third source/drain region, and a floating gate, wherein the third source/drain region is connected to a bit line voltage and the first, second and third source/drain regions are constructed in a N-well region; and an erase gate region adjacent to the floating gate, wherein the erase gate region comprises a n-type source/drain region connected to an erase line voltage and a P-well region; wherein the N-well region and the P-well region are formed in the substrate structure.

Erasable programmable single-ploy nonvolatile memory

The present invention provides a method of fabricating an erasable programmable single-poly nonvolatile memory, comprising the steps of: defining a first area and a second area in a first type substrate; forming a second type well region in the first area; forming a first gate oxide layer and a second gate oxide layer covering a surface of the first area, wherein the second gate oxide layer extends to and is adjacent to the second area; forming a DDD region in the second area; etching a portion of the second gate oxide layer above the second area; forming two polysilicon gates covering the first and the second gate oxide layers; and defining a second type doped region in the DDD region and defining first type doped regions in the second type well region.

Method of fabricating erasable programmable single-poly nonvolatile memory

A nonvolatile memory structure includes a semiconductor substrate having thereon a first oxide define (OD) region, a second OD region and a third OD region arranged in a row. The first, second, and third OD regions are separated from one another by an isolation region. The isolation region includes a first intervening isolation region between the first OD region and the second OD region, and a second intervening isolation region between the second OD region and the third OD region. A select gate transistor is formed on the first OD region. A floating gate transistor is formed on the second OD region. The floating gate transistor is serially coupled to the select gate transistor. The floating gate transistor includes a floating gate that is completely overlapped with the underlying second OD region and is partially overlapped with the first and second intervening isolation regions.

Nonvolatile memory structure and fabrication method thereof

The non-volatile memory cell includes a coupling device and a first select transistor. The coupling device is formed in a first conductivity region. The first select transistor is serially connected to a first floating gate transistor and a second select transistor, all formed in a second conductivity region. An electrode of the coupling device and a gate of the first floating gate transistor are a monolithically formed floating gate; wherein the first conductivity region and the second conductivity region are formed in a third conductivity region; wherein the first conductivity region, the second conductivity region, and the third conductivity region are wells.

Logic-based multiple time programming memory cell compatible with generic CMOS processes

An erasable programmable single-poly nonvolatile memory includes a first PMOS transistor comprising a select gate, a first p-type doped region, and a second p-type doped region, wherein the select gate is connected to a select gate voltage, and the first p-type doped region is connected to a source line voltage; a second PMOS transistor comprising the second p-type doped region, a third p-type doped region, and a floating gate, wherein the third p-type doped region is connected to a bit line voltage; and an erase gate region adjacent to the floating gate, wherein the erase gate region is connected to an erase line voltage.

The invention provides a nonvolatile memory apparatus. The nonvolatile memory apparatus comprises a plurality of memory cells and a signal generator. The memory cells are arranged in an array, and each of the memory cells has a control gate terminal, a floating gate, a source line terminal, a bit-line terminal, a selected gate terminal and a word-line terminal. The signal generator is coupled to the memory cells. When the nonvolatile memory apparatus executes a programming operation, the signal generator provides a programming signal to the control gate terminals of a plurality of inhibited memory cells among the memory cells. Wherein, the programming signal is a pulse signal with a direct-current (DC) offset voltage.

Programming inhibit method of nonvolatile memory apparatus for reducing leakage current

An erasable programmable single-poly nonvolatile memory includes a substrate structure; a floating gate transistor having a floating gate, a gate oxide layer under the floating gate, and a channel region, wherein the channel region is formed in a N-well region; and an erase gate region, wherein the floating gate is extended to and is adjacent to the erase gate region and the erase gate region comprises a n-type source/drain region connected to an erase line voltage and a P-well region. The N-well and P-well region are formed in the substrate structure. The gate oxide layer comprises a first portion above the channel region of the floating gate transistor and a second portion above the erase gate region, and a thickness of the first portion of the gate oxide layer is different from a thickness of the second portion of the gate oxide layer.

An erasable programmable single-poly nonvolatile memory includes a floating gate transistor having a floating gate, a gate oxide layer under the floating gate, and a channel region; and an erase gate region, wherein the floating gate is extended to and is adjacent to the erase gate region. The gate oxide layer comprises a first portion above the channel region of the floating gate transistor and a second portion above the erase gate region, and a thickness of the first portion of the gate oxide layer is different from a thickness of the second portion of the gate oxide layer.

Growing community of inventors

Hsinchu County, Taiwan

Te-Hsun Hsu