Quanta Computer Incorporated

Te-Chuan Wang

Yi-Chieh Chen

Yueh-Chang Wu

Tzu-Hsuan Hsu

Yan-Kuei Chen

Wei-Ju Chen

An example compute cabinet assembly includes an equipment room, an air inlet channel coupled to the equipment room, and a cabinet fan module coupled to the equipment room. The compute cabinet assembly further includes first and second air outlet channels. The first air outlet channel extends along a side of the equipment room towards an outlet of the first air outlet channel. The second air outlet channel extends along another side of the equipment room towards an outlet of the second air outlet channel. The compute cabinet assembly also includes electric fans positioned in the cabinet fan module. The electric fans are configured to create airflow originating at an inlet of the air inlet channel, extending through the equipment room and cabinet fan module, and exiting the compute cabinet assembly at the outlets of the first and second air outlet channels.

Indoor cabinets having reduced acoustic footprints

An example assembly includes an equipment room, a cabinet fan module having fans, and a processor configured to execute logic. Temperature sensors are positioned in the air inlet channel and the equipment room. An electrical component having an air inlet area is also positioned in the equipment room. The logic causes the fans to operate at a predetermined speed, and compare a temperature in the air inlet channel with a temperature at the air inlet area. In response to determining that the temperature at the air inlet area is greater than the temperature in the air inlet channel plus a constant value, the operating speed of the fans is increased. Moreover, the operating speed of the fans is decreased in response to determining that the ambient temperature in the air inlet channel plus a constant value is greater than or equal to the temperature at the air inlet area.

Controlling electric fans of cabinet assemblies

An example compute cabinet assembly includes an equipment room configured to implement electrical components therein, an air inlet channel coupled to a first side of the equipment room, and a cabinet fan module coupled to a second side of the equipment room opposite the first side. A first air outlet channel is coupled to the cabinet fan module and extends along a third side of the equipment room towards a first outlet of the first air outlet channel. Moreover, electric fans are positioned in the cabinet fan module, the electric fans being configured to create an airflow path originating at an inlet of the air inlet channel. The airflow path further extends through the equipment room and cabinet fan module. A guide plate is also positioned adjacent to an inlet of the equipment room, the guide plate being configured to uniformly distribute the airflow path through the equipment room.

Controlled airflow design for indoor cabinet

A sunshield to protect an equipment housing from solar heat and allow cooling from external air flow is disclosed. The sunshield includes a main plate configured to be positioned to cover a side of the equipment housing. A vent in the main plate allows air flow through the main plate to the equipment housing. A shutter is rotatable between an open position allowing air flow through the vent, and a closed position blocking air flow through the vent. A biasing mechanism provides force to bias the shutter in the closed position. The force is overcome by a predetermined level of external air flow on the shutter to rotate the shutter to the open position.

Adaptable sunshield for fan-less electronic component

A cooling system for a rack of servers includes a plurality of cooling circuits, where each cooling circuit is coupled to a server of the rack. Each cooling circuit includes a plurality of cooling modules arranged in parallel. Each cooling module includes a cold plate having a cooling conduit passing therethrough, and a pump fluidly coupled to the cooling conduit. The cooling circuit further includes one or more valves fluidly interconnecting the plurality of cooling modules. Each of the one or more valves, when turned on, fluidly connects the cooling conduits of any two adjacent cooling modules. The cooling system further includes a first cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an inlet pipe, and a second cooling distribution manifold fluidly connected to the cooling circuit of each of the plurality of servers through an outlet pipe.

Cooling circuits for cooling a computing system and flow control methods thereof

A cooling device for a computing system is disclosed. The cooling device includes an inlet conduit, a first cold plate, a connecting conduit, a second cold plate, an outlet conduit, and a heat conductor. Coolant flows through the inlet conduit. The first cold plate has a first inlet surface and a first outlet surface. The inlet conduit is coupled to the first inlet surface. The inlet conduit transfers the coolant into the first cold plate. The connecting conduit is coupled at one end to the first outlet surface. The coolant flows from the first cold plate through the connecting conduit. The second cold plate has a second inlet surface and a second outlet surface, the connecting conduit being coupled at another end to the second inlet surface. The outlet conduit is coupled to the second outlet surface. The coolant flows from the second cold plate through the outlet conduit.

Cooling method for a cold plate module

A computing device includes a sealed computer chassis housing, a heat source, a heat spreader, and a thermal pad. The sealed computer chassis housing, defines an interior space and an exterior surface with a heat sink for the interior space. The heat source is disposed within the interior space. The heat spreader includes a plurality of thermally-conductive protrusions coupled to one or more components of the heat source by an intermediate thermally conductive layer. The thermal pad is positioned above and in thermal contact with the heat spreader. The thermal pad is positioned to contact an interior wall of the sealed computer chassis housing opposite to the heat sink.

Systems for cooling electronic components in a sealed computer chassis

An electronic component such as a fan-less component for a 5G system having an expansion card and optical transceivers is disclosed. The electronic component has a chassis heat sink having a contact surface and a printed circuit board. A transceiver cage is located on the printed circuit board. The cage receives the optical transceiver. The transceiver cage is in thermal contact with the optical transceiver. The system includes a bracket having a heat sink support with a flat surface in thermal contact with the contact surface of the chassis heat sink. The bracket has a transceiver support having a flat surface in thermal contact with the optical transceiver and supporting the expansion card. A connector support is coupled to the heat sink support and the transceiver support. Heat from the optical transceiver is transmitted through the transceiver, connector, and the heat sink supports to the chassis heat sink.

Expansion bracket with heat dissipation for optical transceiver system

A cooling system for an electronic device includes a central processing unit (CPU), a remote heat sink, and a heat-pipe module. The CPU is mounted on a base of the electronic device, and the remote heat sink receives heat generated by the CPU. The heat-pipe module has a plurality of heat pipes for transferring the heat generated by the CPU to the remote heat sink. Each heat pipe has a circular section extending between a first end and a second end. The first end has a flattened, non-circular shape, and is coupled to the base near the CPU. The second end is coupled to the remote heat sink. The first end of each heat pipe is in direct contact with at least another first end of an adjacent heat pipe.

Growing community of inventors

Taoyuan, Taiwan

Te-Chuan Wang