United Microelectronics Corp.

Te-Chih Chen

Tai-Ju Chen

Yi-Han Ye

Chun-Jung Tang

Kung-Hong Lee

A high-voltage FinFET device having LDMOS structure and a method for manufacturing the same are provided. The method includes: providing a substrate with a fin structure to define a first and a second type well regions; forming a trench in the first-type well region to separate the fin structure into a first part and a second part; forming a STI structure in the trench; forming a first and a second polycrystalline silicon gate stack structures at the fin structure; forming discontinuous openings on the exposed fin structure and growing an epitaxial material layer in the openings; doping the epitaxial material layer to form a drain and a source doped layers in the first and second parts respectively; and performing a RMG process to replace the first and second polycrystalline silicon gate stack structures with a first and second metal gate stack structures respectively.

Method for manufacturing a high-voltage FinFET device having LDMOS structure

The present invention provides a method of forming a metal oxide semiconductor (MOS) device comprising a gate structure and an epitaxial structure. The gate structure is disposed on a substrate. The epitaxial structure is disposed in the substrate at two sides of the gate structure and a part thereof serves a source/drain of the MOS, wherein the epitaxial structure comprises: a first buffer layer with a second conductive type, a second buffer layer, and an epitaxial layer with a first conductive type complementary to the second conductive type. The present invention further provides a method of forming the same.

Method for forming metal oxide semiconductor device

A high-voltage FinFET device having LDMOS structure and a method for manufacturing the same are provided. The high-voltage FinFET device includes: at least one fin structure, a working gate, a shallow trench isolation structure, and a first dummy gate. The fin structure includes a first-type well region and a second-type well region adjacent to the first-type well region, and further includes a first part and a second part. A trench is disposed between the first part and the second part and disposed in the first-type well region. A drain doped layer is disposed on the first part which is disposed in the first-type well region, and a source doped layer is disposed on the second part which is disposed in the second-type well region. The working gate is disposed on the fin structure which is disposed in the first-type well region and in the second-type well region.

High-voltage FinFET device having LDMOS structure and method for manufacturing the same

The present invention provides a metal oxide semiconductor (MOS) device, comprising a gate structure and an epitaxial structure. The gate structure is disposed on a substrate. The epitaxial structure is disposed in the substrate at two sides of the gate structure and apart thereof serves a source/drain of the MOS, wherein the epitaxial structure comprises: a first buffer layer with a second conductive type, a second buffer layer, and an epitaxial layer with a first conductive type complementary to the second conductive type. The present invention further provides a method of forming the same.

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Kaohsiung, Taiwan

Te-Chih Chen