Intel Corporation

University of Florida Research Foundation, Incorporated

Taylor W Gaines

Kenneth Boone Wagener

Elah Bozorg-Grayeli

Frederick W Atadana

Michael H Bell

Ken P Hackenberg

Julia Grace Pribyl

Wei Ey Li

James Chris Matayabas, Jr

Edvin Cetegen

Sergio Antonio Chan Arguedas

Vipul V Mehta

Kyle Jordan Arrington

Tony Dambrauskas

Ziyin Lin

Elizabeth Nofen

Hsin-Yu Li

Robert F Cheney

Minseok Ha

Marely E Tejeda Ferrari

Disclosed herein are integrated circuit (IC) package lids with polymer features, as well as related methods and devices. For example, in some embodiments, an IC package may include a package substrate, a lid, and a die between the package substrate and the lid. A foot or rib of the lid may include a polymer material.

Integrated circuit package lids with polymer features

Disclosed herein are structures and techniques for underfill flow management in electronic assemblies. For example, in some embodiments, an electronic assembly may include a first component, a second component, an underfill on the first component and at least partially between the first component and the second component, and a material at a surface of the first component, wherein the material is outside a footprint of the second component, and the underfill contacts the material with a contact angle greater than 50 degrees.

Underfill flow management in electronic assemblies

Microelectronic devices, assemblies, and systems include a microelectronic die and composite material to conduct heat from the microelectronic die such that the composite material includes polymer chains chemically bonded to fill particles having a hexagonal lattice of carbon atoms such as graphene sheet fill particles and/or carbon nanotube fill particles.

Carbon based polymer thermal interface materials with polymer chain to carbon based fill particle bonds

An integrated circuit (IC) assembly comprising an IC die and a frame material that has been dispensed over the assembly substrate to be further adjacent to a perimeter edge of the IC die. The frame material may be selected to have flow properties that minimize slump, for example so a profile of a transverse cross-section through the frame material may retain convex curvature. The frame material may be cured following dispense, and upon application of a thermal interface material (TIM), the frame material may and act as a barrier, impeding flow of the TIM. The frame material may be compressed by force applied through an external thermal solution, such as a heat sink, to ensure good contact to the TIM.

IC assemblies including die perimeter frames suitable for containing thermal interface materials

Embodiments may relate to a method of forming a microelectronic package with an integrated heat spreader (IHS). The method may include placing a solder thermal interface material (STIM) layer on a face of a die that is coupled with a package substrate; coupling the IHS with the STIM layer and the package substrate such that the STIM is between the IHS and the die; performing formic acid fluxing of the IHS, STIM layer, and die; and dispensing, subsequent to the formic acid fluxing, sealant on the package substrate around a periphery of the IHS.

Microelectronic package with underfilled sealant

Embodiments may relate to a microelectronic package that includes an integrated heat spreader (IHS) coupled with a package substrate. The microelectronic package may further include a sealant material between the package substrate and the IHS. The sealant material may be formed of a material that cures when exposed to ultraviolet (UV) wavelengths. Other embodiments may be described or claimed.

Ultraviolet (UV)-curable sealant in a microelectronic package

A device is disclosed. The device includes a first die, a plurality of chiplets above the first die, a first underfill material beneath the chiplets, and a gap fill material between the chiplets. The gap fill material is different from the first underfill material. An interface region is formed between the first underfill material and the gap fill material.

Semiconductor die package with warpage management and process for forming such

A polysulfone has sulfone units that are separated by alkylene units in a polymer chain or a copolymer chain where the alkylene units have at least four carbons between sulfone units. The alkylene units can include an ethenylene unit separated from the sulfone units by at least one methylene units. The polysulfones can be crosslinked for enhanced thermal stability. Membranes can be formed from the polysulfones.

Aliphatic polysulfones with improved mechanical integrity

A sulfonated polyethylene is achieved where a polymethylene backbone with substituted methylene units having one or two sulfonic acid groups or salts of the sulfonic acid groups periodically, quasiperiodically, or quasirandomly separated from each other by unsubstituted methylene units along the polymer backbone. The sulfonated polyethylene is prepared by suspending a sulfonated ester polyethylene in a polar aprotic non-solvent, whereupon the addition of a strong base saponifies the esters with the dissolving of the resulting sulfonated polyethylene having salts of sulfonic acid groups.

Growing community of inventors

Chandler, AZ, United States of America

Taylor W Gaines