Yield Engineering Systems, Inc.

Taylor Nguyen

Christopher F Lane

M Ziaul Karim

Ronald R Stevens

Lei Jing

Eli Vronsky

Gabriel Ormonde

Jed Hsu

Ken Sautter

A solder reflow oven includes a processing chamber that defines an enclosure. The enclosure includes a spindle configured to support a substrate and rotate the substrate about a central axis of the processing chamber. The spindle is also configured to move vertically along the central axis and position the substrate at different locations within the enclosure. The oven further includes a chemical delivery tube configured to direct a chemical vapor into the enclosure, a lamp assembly configured to heat a top surface of the substrate, and a lift assembly configured to move the spindle along the central axis.

Processing oven

Growing community of inventors

Milpitas, CA, United States of America

Taylor Nguyen